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OverviewFull Product DetailsAuthor: Katsuaki Suganuma (The Institute of Scientific and Industrial Research, Osaka University, Japan)Publisher: Elsevier Science & Technology Imprint: Woodhead Publishing Ltd Weight: 0.400kg ISBN: 9780081020944ISBN 10: 0081020945 Pages: 240 Publication Date: 30 May 2018 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsPart 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates Part 2 Components 4. Magnetic materials Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation Part 4 Future Prospects 9. Future SolutionsReviewsAuthor InformationDr. Katsuaki Suganama graduated from Tohoku University Faculty of Engineering in 1977, and since then has had a highly influential role within the fields of Physical properties of metals/Metal-base materials, Inorganic industrial materials, Metal making/Resorce production engineering, Material processing/Microstructural control engineering, Structural/Functional materials, Composite materials/Surface and interface engineering, Inorganic materials/Physical properties, Electronic materials/Electric materials. He has published several academic papers and books during his career, and has won many prestigious awards such as Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics and the Richard M. Fularth Pacific Award. He has worked as Professor at Osaka University Institute of Scientific and Industrial Research since 1996. Tab Content 6Author Website:Countries AvailableAll regions |
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