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OverviewFull Product DetailsAuthor: George W. Pan (Arizona State University, Tempe, Arizona, USA)Publisher: John Wiley & Sons Inc Imprint: Wiley-IEEE Press Dimensions: Width: 16.00cm , Height: 3.00cm , Length: 24.10cm Weight: 0.896kg ISBN: 9780471419013ISBN 10: 047141901 Pages: 552 Publication Date: 25 February 2003 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsReviewsAuthor InformationGEORGE W. PAN, PhD, is Professor of Electrical Engineering and Director of the Electronic Packaging Lab at Arizona State University. He was previously a professor of electrical engineering and director of the Signal Propagation Lab at the University of Wisconsin-Milwaukee. Professor Pan is a senior member of the IEEE and has served as a technical consultant for Boeing Aerospace Co., Cray Research, Mayo Foundation, and other corporations. He is a contributing author to Modeling and Simulation of High Speed VLSI Interconnects. Tab Content 6Author Website:Countries AvailableAll regions |
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