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OverviewFull Product DetailsAuthor: Chih-Hang Tung , George T. T. Sheng , Chih-Yuan LuPublisher: John Wiley & Sons Inc Imprint: Wiley-Interscience Dimensions: Width: 18.40cm , Height: 3.70cm , Length: 26.00cm Weight: 1.370kg ISBN: 9780471457725ISBN 10: 0471457728 Pages: 680 Publication Date: 14 October 2003 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsFOREWORD ix PREFACE xi PART I 1 1 Microelectronics and Microscopy 3 2 ULSI Process Technology 36 3 Applications of TEM for Construction Analysis 61 4 TEM Sample Preparation Techniques 90 PART II 141 5 Ion Implantation and Substrate Defects 143 6 Dielectrics and Isolation 179 7 Silicides, Polycide, and Salicide 256 8 Metallization and Interconnects 287 PART III 343 9 ULSI Devices I: DRAM Cell with Planar Capacitor 345 10 ULSI Devices II: DRAM Cell with Stacked Capacitor 365 11 ULSI Devices III: DRAM Cell with Trench Capacitor 399 12 ULSI Devices IV: SRAM 445 PART IV 475 13 TEM in Failure Analysis 477 14 Novel Devices and Materials 526 15 TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies 558 16 High-Resolution TEM in Microelectronics 609 INDEX 647Reviews...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue. (IEEE Solid--State Circuits Society Newsletter, January 2004) !strongly recommended! (E--Streams, Vol. 7, No. 4) ...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue. (IEEE Solid-State Circuits Society Newsletter, January 2004) ?strongly recommended? (E-Streams, Vol. 7, No. 4) ...provides a historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issue. (IEEE Solid-State Circuits Society Newsletter, January 2004) ...strongly recommended... (E-Streams, Vol. 7, No. 4) Author InformationCHIH-HANG TUNG is a senior member of the technical staff and Project Leader at the Institute of Microelectronics in Singapore. GEORGE T. T. SHENG was the first to develop cross-sectioning samples of TEM studies of semiconductor devices and has been involved with many other groundbreaking projects at Bell Labs. CHIH-YUAN LU is Chairman and CEO of Ardentec Corp., an ULSI testing service company. He is also CTO of Macronix International Co., Ltd., the eighth largest worldwide NVM semiconductor company. Tab Content 6Author Website:Countries AvailableAll regions |