Transactions on Engineering Technologies: World Congress on Engineering 2019

Author:   Sio-Iong Ao ,  Len Gelman ,  Haeng Kon Kim
Publisher:   Springer Verlag, Singapore
Edition:   1st ed. 2021
ISBN:  

9789811582752


Pages:   247
Publication Date:   26 October 2021
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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Transactions on Engineering Technologies: World Congress on Engineering 2019


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Author:   Sio-Iong Ao ,  Len Gelman ,  Haeng Kon Kim
Publisher:   Springer Verlag, Singapore
Imprint:   Springer Verlag, Singapore
Edition:   1st ed. 2021
Weight:   0.403kg
ISBN:  

9789811582752


ISBN 10:   9811582750
Pages:   247
Publication Date:   26 October 2021
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

Table of Contents

Selected topics in mechanical engineering. -Selected topics in bioengineering. -Selected topics in internet engineering. -Selected topics in image engineering. -Selected topics in wireless networks. -Selected topics in knowledge engineering. -Selected topics in manufacturing engineering. -Selected topics in industrial applications

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Dr. Sio-Iong Ao finished his doctoral research at The University of Hong Kong and postdoctoral researches at the University of Oxford and Harvard University and is a former Visiting Professor of Cranfield University, UK, and University of Wyoming, USA. Len Gelman, PhD, Dr. of Sciences (Habilitation) joined HuddersfieldUniversity as Professor, Chair in Signal Processing/ Condition Monitoring and Director of Centre for Efficiency and Performance Engineering, in 2017 from Cranfield University, where he worked as Professor and Chair in Vibro-Acoustical Monitoring since 2002. Len developed novel condition monitoring technologies for aircraft engines, gearboxes, bearings, turbines and centrifugal compressors. Len published more than 250 publications, 17 patents and is co-editor of 11 Springer books. He is Fellow of:BINDT, International Association of Engineers and Institutionof Diagnostic Engineers, Executive Director, International Society for Condition Monitoring, Honorary Technical Editor, International Journal of Condition Monitoring, Editor-in-Chief, International Journal of Engineering Sciences (SCMR),Chair, annual International Condition Monitoring Conferences, Honorary Co-Chair, annual World Congresses of Engineering, Co-Chair, International Conference COMADEM 2019 and  Chair, International Scientific Committee of Third World Congress, Condition Monitoring. He was General Chair,First World Congress, Condition Monitoring, Chair, Second World Congress, Engineering Asset Management and Chair, International Committee of Second World Congress, Condition Monitoring.Len is Chair of International CM Groups of ICNDT and EFNDT and Member of ISO Technical Committee, Condition Monitoring. Len made 42 plenary keynotes at major international conferences. He was Visiting Professor at ten Universities abroad. Professor Haeng-Kon Kim is a Vice President of Research and Information, a Dean of engineering college and a Professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA Center in USA. Professor Kim is Chief Editor of KIPS SE-Sig journal and Korea Multimedia Society, an editorial board of KISS (Korea Information Science Society) and a steering committee of KIPS (Korea Information Processing Society).

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