Overview

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.

Full Product Details

Author:   Jain Pushkar ,  Eugene J. Rymaszewski
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   Softcover reprint of the original 1st ed. 2004
Dimensions:   Width: 15.50cm , Height: 1.00cm , Length: 23.50cm
Weight:   0.285kg
ISBN:  

9781461348085

ISBN 10:   1461348080
Pages:   158
Publication Date:   23 February 2014
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand  
We will order this item for you from a manufactured on demand supplier.

Table of Contents

1 Introduction.- 1.1 Capacitor Fundamentals.- 1.2 Application Domains.- 1.3 Physical Structures/Embodiments.- 1.4 Capacitor Integration Drivers.- 1.5 Thin-Film Capacitor Technology.- 1.6 Summary.- 1.7 References.- 2 Design Fundamentals.- 2.1 Breakdown Voltage and Capacitance Density Design Limits.- 2.2 Tolerance in Capacitance Density.- 2.3 DC Leakage.- 2.4 Capacitor Losses.- 2.5 Series Inductance and Resistance.- 2.6 References.- 3 Performance Detractors.- 3.1 Interfacial Micro-roughness.- 3.2 Deviation from Optimal Stoichiometry.- 3.3 Film Microstructure.- 3.4 References.- 4 Electrical Characterization.- 4.1 Thin Film Decoupling Capacitors.- 4.2 Characterization Methodologies.- 4.3 Test Vehicle: Design and Fabrication.- 4.4 Dielectric Constant and Loss.- 4.5 Total Series Inductance.- 4.6 Leakage Current Density.- 4.7 Capacitance Density and Breakdown Field.- 4.8 Summary and Conclusion.- 4.9 References.- 5 Integration Issues and Challenges.- 5.1 Metal Diffusion into Dielectrics.- 5.2 Interlayer Stresses and Adhesion.- 5.3 Low Thermal Budget.- 5.4 References.- 6 Applications.- 6.1 2D Interconnections in ICs.- 6.2 Integration into 2D Packaging.- 6.3 Flex Circuits.- 6.4 Large Area Power Distribution.- 6.5 Integration into 3D Structures.- 6.6 Electromagnetic Considerations.- 6.7 Power Electronics.- 6.8 References.

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