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OverviewIn a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging. Full Product DetailsAuthor: Ralph Remsburg (Opvista, Irvine, California, USA) , Jerry C. Whitaker (Technical Press, Morgan Hill, California, USA) , Richard C. Dorf (University of California, Davis, USA)Publisher: Taylor & Francis Inc Imprint: CRC Press Inc Volume: 10 Dimensions: Width: 15.60cm , Height: 2.20cm , Length: 23.40cm Weight: 0.808kg ISBN: 9780849300820ISBN 10: 0849300827 Pages: 396 Publication Date: 27 September 2000 Audience: Professional and scholarly , Professional and scholarly , Professional & Vocational , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsPreface. Nomenclature and Symbology. Unit Conversion Factors. Introduction to Formulas for Thermal Design of Electronic Equipment. Formulas for Conduction Heat Transfer in Electronic Equipment. Formulas for Fluid Dynamics for Electronic Equipment. Convection Heat Transfer in Electronic Equipment. Radiation Heat Transfer in Electronic Equipment. Heat Transfer with Phase Change. Combined Modes of Heat Transfer for Electronic Equipment. Appendix.ReviewsAuthor InformationRalph Remsburg Tab Content 6Author Website:Countries AvailableAll regions |
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