The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Author:   Gerard Kelly
Publisher:   Kluwer Academic Publishers
Edition:   1999 ed.
ISBN:  

9780792384854


Pages:   134
Publication Date:   30 April 1999
Format:   Hardback
Availability:   In Print   Availability explained
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages


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Author:   Gerard Kelly
Publisher:   Kluwer Academic Publishers
Imprint:   Kluwer Academic Publishers
Edition:   1999 ed.
Dimensions:   Width: 17.00cm , Height: 1.10cm , Length: 24.40cm
Weight:   0.910kg
ISBN:  

9780792384854


ISBN 10:   0792384857
Pages:   134
Publication Date:   30 April 1999
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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