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Overview"The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in ""Assembly Engineering"" and ""Electronic Packaging and Production,"" will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation." Full Product DetailsAuthor: Frank Riley , Electronic Packaging and ProductionPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Weight: 1.650kg ISBN: 9783540194491ISBN 10: 3540194495 Pages: 603 Publication Date: 09 August 1988 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Out of Print Availability: Out of stock  Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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