Overview

"Although Surface Mount Technology (SMT) is now well established, encompassing a wide range of assembly routes for electronics circuitry, the trend is towards greater miniaturzsation and component lead pitches are getting finer and finer. SMT with fine pitch components is one of the most complex manufacturing technologies in use in volume production today. The advantages of surface mounting with fine pitch components, namely high yields at lower cost with improved reliability, are much in demand. Hans Danielsson is a ""production man"" and this features strongly in the contents of the book which flows from an industry consideration to design characteristics to process and quality considerations, and finishes with more generic discussions of where assembly technology is going. ""Surface Mounting Technology with Fine Pitch Materials"" provides process engineers and production managers in the electronics manufacturing with a state-of-the-art guide to this fast changing technology. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the complex manufacturing processed involved. Desingers too will benefit from reading about the many design-related issues addressed in this book. This book should be of interest to production, manufacturing engineers and managers in electronics manufacturing."

Full Product Details

Author:   H. Danielsson
Publisher:   Chapman and Hall
Imprint:   Chapman and Hall
Edition:   1994 ed.
Dimensions:   Width: 15.50cm , Height: 1.50cm , Length: 23.50cm
Weight:   1.190kg
ISBN:  

9780412553400

ISBN 10:   0412553406
Pages:   242
Publication Date:   30 November 1994
Audience:   General/trade ,  Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.

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