Overview

"This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The chapters are a ""walk-through"" of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues current to the industry."

Full Product Details

Author:   Ray Prasad
Publisher:   Chapman and Hall
Imprint:   Chapman and Hall
Edition:   2nd ed. 1997
Dimensions:   Width: 15.50cm , Height: 4.20cm , Length: 23.50cm
Weight:   2.850kg
ISBN:  

9780412129216

ISBN 10:   0412129213
Pages:   772
Publication Date:   31 March 1997
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

One Introduction to Surface Mounting.- 1 Introduction to Surface Mount Technology.- 2 Implementing SMT In-House and at Subcontractors.- Two Designing with Surface Mounting.- 3 Surface Mount Components.- 4 Substrates for Surface Mounting.- 5 Surface Mount Design Considerations.- 6 Surface Mount Land Pattern Design.- 7 Design for Manufacturability, Testing, and Repair.- Three Manufacturing with Surface Mounting.- 8 Adhesive and Its Application.- 9 Solder Paste and Its Application.- 10 Metallurgy of Soldering and Solderability.- 11 Component Placement.- 12 Soldering of Surface Mounted Components.- 13 Flux and Cleaning.- 14 Quality Control, Inspection Repair, and Testing.- Appendix A.- Surface Mount Standards.- Appendix B.- Detailed Questionnaire for Evaluating Smt Equipment:Pick-and-Place (Appendix B1), Screen Printer (Appendix B2), and Reflow Oven (appendix b3).- Appendix c glossary.

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