Substrate Noise Coupling in RFICs

Author:   Ahmed Helmy ,  Mohammed Ismail
Publisher:   Springer-Verlag New York Inc.
Edition:   2008 ed.
ISBN:  

9781402081651


Pages:   119
Publication Date:   08 April 2008
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Substrate Noise Coupling in RFICs


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Overview

Substrate noise coupling in integrated circuits (ICs) is the process by which int- ference signals in the form of voltage and current glitches cause parasitic currents to ?ow in the silicon substrate to various parts of the IC. The source of such glitches and parasitic currents could be from the switching noise of high speed digital clocks on the same chip. In RF and mixed signal ICs the switching noise is coupled to sensitive analog and RF nodes in the IC causing degradation in performance that could severely impact the yield. Thus, overcoming substrate coupling is a key issue in successful “system on chip” ?rst-pass integration where RF and mixed signal blocks, high speed digital I/O interface are integrated with digital signal proce- ing algorithms on the same chip. This is particularly true as we move to sub-90 nanometer system on chip integration. In this book a substrate aware design ?ow is built, calibrated to silicon and used as part of the design and validation ?ows to uncover and ?x substrate coupling problems in RF ICs. The ?ow is used to develop a comprehensive RF substrate noise isolation design guide to be used by RF designers during the ?oor planning, circuit design and validation phases. This will allow designers to optimize the - sign, maximize noise isolation and protect sensitive analog/RF blocks from being degraded by substrate noise coupling.

Full Product Details

Author:   Ahmed Helmy ,  Mohammed Ismail
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   2008 ed.
Dimensions:   Width: 15.60cm , Height: 0.90cm , Length: 23.50cm
Weight:   0.820kg
ISBN:  

9781402081651


ISBN 10:   1402081650
Pages:   119
Publication Date:   08 April 2008
Audience:   College/higher education ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Analysis of Substrate Noise Coupling.- Experimental Data to Calibrate the Design Flow.- Design Guide for Substrate Noise Isolation in RF Applications.- On Chip Inductors Design Flow.- Case Studies for the Impacts and Remedies of Substrate Noise Coupling.- Conclusion and Future Work.

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Author Information

Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series

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