Overview

This guide aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of today's surface mount technology. It shows how to use solder paste technology to improve interconnection performance and efficiency in hybrid circuits, printed circuits, and components. Coverage includes basic solder paste technologies, application techniques, reliability and testing, and solutions to specific problems. This book should be of interest to electronic engineers.

Full Product Details

Author:   Jennie Hwang
Publisher:   Van Nostrand Reinhold Inc.,U.S.
Imprint:   Van Nostrand Reinhold Inc.,U.S.
Edition:   New edition
Dimensions:   Width: 15.20cm , Height: 2.40cm , Length: 22.90cm
Weight:   0.703kg
ISBN:  

9780442013530

ISBN 10:   0442013531
Pages:   456
Publication Date:   24 September 1992
Audience:   Professional and scholarly ,  General/trade ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Out of stock  
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

I-Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II-Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III-Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV-Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problems.- 11 Quality Assurance and Tests.- V-Future Tasks and Emerging Trends.- 12 Future Developments.- VI-Appendix.- I. Federal Specification QQ-S-571E and Amendment 4.- II. Ternary Phase Diagram: Pb-Ag-Sn, Sn-Pb-Bi.- III. Military Specification MIL-P-28809A: Printed Wiring Assemblies.- IV. Quantitative Determination of Rosin Residues on Cleaned Electronics Assemblies.

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