Silicon Germanium: Technology, Modeling, and Design

Author:   Raminderpal Singh (IBM) ,  Modest M. Oprysko (IBM) ,  David Harame (IBM)
Publisher:   John Wiley & Sons Inc
ISBN:  

9780471446538


Pages:   368
Publication Date:   21 November 2003
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Silicon Germanium: Technology, Modeling, and Design


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Full Product Details

Author:   Raminderpal Singh (IBM) ,  Modest M. Oprysko (IBM) ,  David Harame (IBM)
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-IEEE Press
Dimensions:   Width: 16.30cm , Height: 2.20cm , Length: 24.20cm
Weight:   0.642kg
ISBN:  

9780471446538


ISBN 10:   047144653
Pages:   368
Publication Date:   21 November 2003
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

Contributors. Foreword. Preface. Acknowledgments. Introduction. A Historical Perspective at IBM. Technology Development. Modeling and Characterization. Design Automation and Signal Integrity. Leading-Edge Applications. Appendix. Index. About the Authors.  

Reviews

The text is recommended for engineering libraries serving electrical and computer engineering programs and engineers. (E-STREAMS, October 2004)


Author Information

RAMINDERPAL SINGH, PhD, is a Senior Engineer at IBM’s RF/AMS Design Kit Group where he leads various projects related to transmission line model development, substrate modeling, and RF/mixed-signal design methodologies. Dr. Singh has authored numerous technical publications in the area of signal integrity, and is Director of VSIA, as well as a Senior Member of IEEE. DAVID L. HARAME, PhD, is Director of the RF/Analog and Mixed Signal Process Development, Modeling, and Design Automation area at IBM. He is an IEEE Fellow, Executive Committee member of the Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), and member of the Compact Model Council. MODEST M. OPRYSKO, PhD, joined IBM in 1986 and has held numerous management positions directing technology and application development activities spanning the areas of fiber optics, wireless (infrared and radio frequency technology), packaging technology, and circuit design devoted to communications applications. Currently, he is the Senior Manager of Communication Link Architecture, Design and Test.

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