Signal and Power Integrity in Digital Systems: TTL, CMOS, and BiCMOS

Author:   James Buchanan
Publisher:   McGraw-Hill Education - Europe
ISBN:  

9780070087347


Pages:   400
Publication Date:   01 January 1996
Format:   Hardback
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

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Signal and Power Integrity in Digital Systems: TTL, CMOS, and BiCMOS


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Overview

This book provides guidance for addressing many of the critical signal and power integrity issues that designers of high-speed digital systems face. The fast switching edges of today's TTL, CMOS, and BiCMOS logic devices have introduced many new signal and power integrity problems and worsened most of the old ones, and as a result it is difficult to design and build cost-effective digital systems. The book's purpose is to help designers reach an understanding of the issues that must be addressed and provide practical engineering solutions.

Full Product Details

Author:   James Buchanan
Publisher:   McGraw-Hill Education - Europe
Imprint:   McGraw-Hill Professional
Dimensions:   Width: 16.00cm , Height: 2.40cm , Length: 23.40cm
Weight:   0.675kg
ISBN:  

9780070087347


ISBN 10:   0070087342
Pages:   400
Publication Date:   01 January 1996
Audience:   College/higher education ,  Professional and scholarly ,  General/trade ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Out of Print
Availability:   In Print   Availability explained
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

Table of Contents

Introduction.Advanced Schottky TTL, Advanced CMOS, and BiCMOS Logic Families.Advanced Schottky TTL, CMOS and BiCMOS Logic Circuits.Inductance and Transient Switching Currents.Power Distribution.Signal Interconnections.Transmission-Line Effects.Clock Distribution.Device, Board, and Unit Interfaces.Noise Tolerant Logic Architectures.Worst-Case Timing.System Initialization and Low-Voltage Sensing.Memory Subsystem Design.Using PALs, FIFOs, and Other LSI Devices.ASIC Application Tips.

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