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OverviewThe objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of electronic and telecommunications component reliability. As a reference source, it summarizes the knowledge on failure modes, degradation and mechanisms, including a survey of accelerated testing, achieving better reliability, total quality topics, screening tests and prediction methods. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography round the benefit offered by the book. The technical level suites to senior and graduate students, as well as to experts and managers in industries. Full Product DetailsAuthor: Titu Bajenescu , Marius BazuPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: illustrated edition ISBN: 9783540657224ISBN 10: 3540657223 Pages: 550 Publication Date: April 1999 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In stock  We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsIntroduction; State of the Art in Reliability; Reliability of passive electronic parts; Reliability of Diodes; Reliability of Silicon Transistors; Reliability of Thyristors; Reliability of Integrated Circuits; Reliability of Hybrids; Reliability of Memories; Reliability of Optoelectronics; Noise and Reliability; Plastic Package and Reliability; Test and Testability of Logic ICs; Failure Analysis; Appendix.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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