Reliability Engineering for Electronic Design

Author:   Norman. B. Fuqua
Publisher:   Taylor & Francis Inc
Volume:   34
ISBN:  

9780824775711


Pages:   406
Publication Date:   01 January 1987
Format:   Hardback
Availability:   In Print   Availability explained
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Reliability Engineering for Electronic Design


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Overview

This book addresses the needs of electronic design engineers, reliability engineers, and their respective managers, stressing a pragmatic viewpoint rather than a vigorous mathematical presentation.

Full Product Details

Author:   Norman. B. Fuqua
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Volume:   34
Dimensions:   Width: 15.20cm , Height: 2.50cm , Length: 22.90cm
Weight:   0.910kg
ISBN:  

9780824775711


ISBN 10:   0824775716
Pages:   406
Publication Date:   01 January 1987
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Part I: Introduction 1. Basic Theory and Mathematics Part II: Detail Part Considerations 2. Part Selection, Specification, and Control 3. Part Application and Derating 4. Electrostatic Discharge Part III: Circuit Design and Analysis 5. Circuit Analysis Methods and Techniques 6. Redundancy 7. Failure Mode, Effects and Criticality Analysis 8. Fault Tree Analysis Part IV: System Design and Analysis 9. System Reliability Analysis 10. Environmental Considerations 11. Production and use Reliability Part V: Management and Testing 12. Reliability Demonstration and Qualification 13. Reliability Growth Management 14. Environmental Stress Screening 15. Reliability Program Management

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Author Information

Norman B. Fuqua is a Research Engineer at the Reliability Analysis Center, Griffiss Air Base, New York, which is operated by the Illinois Institute of Technology.

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