|
|
|||
|
||||
OverviewFull Product DetailsAuthor: Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) , Lucian Kasprzak (Siemens Healthcare Diagnostics (Retired)) , Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) , Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired))Publisher: Elsevier Science Publishing Co Inc Imprint: Academic Press Inc Edition: 2nd edition Dimensions: Width: 15.20cm , Height: 4.00cm , Length: 22.90cm Weight: 1.110kg ISBN: 9780120885749ISBN 10: 0120885743 Pages: 758 Publication Date: 23 October 2014 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Awaiting stock The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you. Table of Contents1. An Overview of Electronic Devices and Their Reliability 2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated 3. Defects, Contamination and Yield 4. The Mathematics of Failure and Reliability 5. Mass Transport-Induced Failure 6. Electronic Charge-Induced Damage 7. Environmental Damage to Electronic Products 8. Packaging Materials, Processes, and Stresses 9. Degradation of Contacts and Packages 10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices 11. Characterization and Failure Analysis of Material, Devices and Packages 12. Future Directions and Reliability IssuesReviewsAuthor InformationDr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise. Tab Content 6Author Website:Countries AvailableAll regions |