Reliability and Failure of Electronic Materials and Devices

Author:   Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired))
Publisher:   Elsevier Science Publishing Co Inc
ISBN:  

9780125249850


Pages:   720
Publication Date:   12 June 1998
Replaced By:   9780120885749
Format:   Hardback
Availability:   Out of print, replaced by POD   Availability explained
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Reliability and Failure of Electronic Materials and Devices


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Author:   Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired)) ,  Milton Ohring (Stevens Institute of Technology, Hoboken, NJ, USA (Retired))
Publisher:   Elsevier Science Publishing Co Inc
Imprint:   Academic Press Inc
Dimensions:   Width: 15.20cm , Height: 3.70cm , Length: 22.90cm
Weight:   1.090kg
ISBN:  

9780125249850


ISBN 10:   0125249853
Pages:   720
Publication Date:   12 June 1998
Audience:   Professional and scholarly ,  Professional & Vocational
Replaced By:   9780120885749
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of print, replaced by POD   Availability explained
We will order this item for you from a manufatured on demand supplier.

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Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

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