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OverviewThe increasing application of integrated circuits in situations where high reliability is needed places a requirement on the manufacturer to use methods of testing to eliminate devices that may fail on service. One possible approach that is described in this book is to make precise electrical measurements that may reveal those devices more likely to fail. The measurements assessed are of analog circuit parameters which, based on a knowledge of failure mechanisms, may indicate a future failure. . To incorporate these tests into the functional listing of very large scale integrated circuits consideration has to be given to the sensitivity of the tests where small numbers of devices may be defective in a complex circuit. In addition the tests ideally should require minimal extra test time. A range of tests has been evaluated and compared with simulation used to assess the sensitivity of the measurements. Other work in the field is fully referenced at the end of each chapter. The team at Lancaster responsible for this book wish to thank the Alvey directorate and SERe for the necessary support and encouragement to publish our results. We would also like to thank John Henderson, recently retired from the British Telecom Research Laboratories, for his cheerful and enthusiastic encouragement. Trevor Ingham, now in New Zealand, is thanked for his early work on the project. Full Product DetailsAuthor: A.P. Dorey , B.K. Jones , A.M.D. Richardson , Y.Z. XuPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 1990 Dimensions: Width: 17.00cm , Height: 1.20cm , Length: 24.40cm Weight: 0.382kg ISBN: 9781461278795ISBN 10: 1461278791 Pages: 212 Publication Date: 08 March 2012 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of Contents1 Introduction to VLSI Testing.- 1.1 The Problem.- 1.2 Reliability Testing.- 1.3 The CMOS Process.- 1.4 Failure Modes and Mechanisms in CMOS.- 1.5 Outline of the Project.- 1.6 Choice of Devices.- 1.7 Outline of the Book.- References.- 2 The Devices Studied and Their Simulation.- 2.1 Introduction.- 2.2 Details of the Devices Studied.- 2.3 SPICE Circuit Files and Device Parameters.- 2.4 Simulation Procedures.- 2.5 Results.- 2.6 Conclusions.- Reference.- 3 The Tests and Stress Experiments.- 3.1 Introduction to the Test Procedures.- 3.2 Accelerated Stress Methods.- 3.3 Details of the Tests Used.- 3.4 Organization of the Experiment.- References.- 4 Assessment of the Tests as Predictors of Failure.- 4.1 Behavior of the Devices Subject to Thermal and Electrical Stress.- 4.2 Behavior of Devices Subject to Ionizing Irradiation Stress.- 4.3 Assessment of the Tests.- References.- 5 Implementation of the Tests for Industrial Use.- 5.1 Introduction.- 5.2 Test Strategies.- 5.3 Extension of Tests to VLSI.- 5.4 Implementation of the Test on a Digital Tester.- 5.5 Reliability Test Equipment and Techniques.- 5.6 Implementation of the Tests using Dedicated Analog Circuits.- 5.7 Application to Other Digital Families.- References.- 6 Conclusions.- 6.1 Validity of the Experiments.- 6.2 Recommended Tests.- 6.3 Use of the Tests.- 6.4 Further Work.- Appendix 1 SPICE Circuit Files Used in the Simulations.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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