Free Delivery Over $100
|
|
|||
|
||||
OverviewPulsed and pulsed bias sputter deposition are advanced thin deposition techniques that allow one to produce high quality metal and insulating films. In the pulsed sputtering case, the technique allows one to deposit insulating films while minimizing adverse effects associated with charge accumulation on the target in the reactive deposition mode. In the pulsed bias sputtering case, one can deposit metal films on an insulating substrate while controlling the degree of charging on the substrate. One of the important aspects of these techniques is to be able to control the film properties such as density, orientation, texture, and morphology during deposition. This book provides basic knowledge on the design of the instrumentation for pulsed and pulsed bias sputtering techniques as well as the knowledge for the control of thin film properties using the deposition parameters such as pulsing cycle and duty. This book focuses on the basic principles and experimentation of the field. Full Product DetailsAuthor: Edward V. Barnat , Toh-Ming LuPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2003 ed. Dimensions: Width: 15.50cm , Height: 1.10cm , Length: 23.50cm Weight: 0.950kg ISBN: 9781402075438ISBN 10: 140207543 Pages: 157 Publication Date: 30 September 2003 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents1 Introduction.- 2 Basic Plasma Phenomenon.- 3 Plasma Sources Used for Sputter Deposition.- 4 Response of a Plasma to an Applied Bias.- 5 Sinusoidal Waveform.- 6 Pulsed Waveform.- 7 Application Of A Pulsed Waveform to a Target: Pulsed Reactive Sputtering.- 8 Application of a Pulsed Waveform to a Substrate: Pulsed Bias Sputtering.- 9 Conclusions and Future Directions.- References.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
||||
