Overview

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

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​Dr. Mohd Arif Anuar Mohd Salleh is an Associate Professor under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. He graduated with B.Eng honours in Mechanical Engineering (2006) followed by M.Eng in Mechanical Engineering majoring in Materials (2007) from the Universiti Tun Hussein Onn Malaysia. He received his PhD in 2016 from the University of Queensland, Australia in the field of Materials Engineering specifically in the development of advance solder materials. He is currently the President of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. He has experience working and lecturing in the electronic packaging materials field for more than 13 years. He also worked as part time research officer for a few research projects on solder materials development at the University of Queensland Australia (2013-2015) and at Imperial College London (2015). Dr. Dewi Suriyani Che Halin is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng honours in Mineral Resources Engineering (2004) and Masters in Science (M. Sc.) in Materials Engineering (2005) from Universiti Sains Malaysia. She received her PhD in 2009 from Universiti Kebangsaan Malaysia in the field of Materials Science specifically in the semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in the surface engineering and electronic packaging materials field for more than 11 years. Dr. Kamrosni Abdul Razak is a Senior Lecturer under the Materials Engineering Programme at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. She graduated with B.Eng with honours in Mechanical Engineering (2004) from Universiti Kebangsaan Malaysia.  She received her Master in Science (M. Sc.) in Materials Engineering (2012) and PhD in 2020 from Universiti Malaysia in the field of Materials Science specifically in semiconductor materials. She is currently the member of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. She has experience working and lecturing in materials field for more than 11 years. Dr. Mohd Izrul Izwan Ramli obtained his PhD from the Universiti Malaysia Perlis (UniMAP) Malaysia, in materials engineering. Currently he works as a Postdoctoral researcher at Universiti Malaysia Perlis (UniMAP). His research interests are in the areas of materials engineering, focusing on the development of lead-free solder alloys for electric/electronic interconnects. His research activities includeusing advance material characterizations technique such as synchrotron imaging, synchrotron XRF and synchrotron tomography and have contributed to several leading discoveries in solder alloy development.

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