Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The Most Complete and Widely Used Guide to Printed Circuits, Now Updated and Thoroughly Revised The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance. Written by a team of experts from around the world, this encyclopedic resource has been thoroughly revised and expanded to include the latest printed circuit tools and technologies – from design to fabrication. Hundreds of illustrations and charts demonstrate key concepts, and valuable tables provide quick and easy access to essential information. This new edition of the most trusted guide to printed circuits includes: Introduction to Printed Circuits Supply Chain Management Lead-Free Materials and Processes Engineering and Design of Printed Circuits Base Materials for All Applications Fabrication Processes High Density Interconnection Bare Board Testing Assembly Processes Soldering Materials and Processes Non-Solder Interconnection Quality Specification and Assessment Reliability Prediction and Assessment Assembly Testing Repair and Rework Flexible Circuits And Much More

Full Product Details

Author:   Clyde Coombs ,  Happy Holden
Publisher:   McGraw-Hill Education - Europe
Imprint:   McGraw-Hill Inc.,US
Edition:   7th edition
Dimensions:   Width: 19.80cm , Height: 6.40cm , Length: 24.90cm
Weight:   2.599kg
ISBN:  

9780071833950

ISBN 10:   0071833951
Pages:   1648
Publication Date:   16 December 2015
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock  
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

Table of Contents

Part 1: Printed Circuit Technology Drivers Chapter 1. Electronic Packaging and High-Density Interconnectivity Clyde F. Coombs, Jr., and Happy T. Holden 3 1.1 Introduction / 3 1.2 Measuring the Interconnectivity Revolution / 3 1.3 Hierarchy of Interconnections / 6 1.4 Factors Affecting Selection of Interconnections / 7 1.5 ICs and Packages / 9 1.6 Density Evaluations / 10 1.7 Methods to Increase PWB Density / 13 1.8 References / 18 Chapter 2. Types of Printed Wiring Boards Hayao Nakahara 19 2.1 Introduction / 19 2.2 Classification of Printed Wiring Boards / 19 2.3 Organic and Nonorganic Substrates / 21 2.4 Graphical and Discrete-Wire Boards / 21 2.5 Rigid and Flexible Boards / 22 2.6 Graphically Produced Boards / 22 2.7 Molded Interconnection Devices / 27 2.8 Plated-Through-Hole Technologies / 27 2.9 Summary / 30 2.10 References / 30 Part 2: Managing the Printed Circuit Supply Chain Chapter 3. Basics of Printed Circuit Supply Chain Management Tim Rodgers 33 3.1 Introduction / 33 3.2 General Business Considerations / 34 3.3 Contract Manufacturers / 35 3.4 Criteria for Evaluating Suppliers / 35 3.5 Supplier Selection Criteria Example / 41 Chapter 4. Design for Manufacturability Tim Rodgers 43 4.1 General Principles / 43 4.2 PCB/PCA Pricing Models / 44 4.3 Process Cost Drivers / 49 4.4 Production Yield and Design for Manufacturability / 51 4.5 DFM Complexity Models / 59 Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange Happy T. Holden 63 5.1 Introduction / 63 5.2 Manufacturing Information / 64 5.3 Fabrication Information Exchange / 68 5.4 Data Exchange Formats / 73 5.5 Initial Design Review / 86 5.6 Design Input / 94 5.7 Design Analysis and Review / 99 5.8 Acknowledgments / 99 5.9 References / 100 Chapter 6. Supplier Selection and Qualification Tim Rodgers 101 6.1 Introduction / 101 6.2 Evaluating Suppliers / 102 6.3 Supplier Selection / 113 6.4 Supplier Qualification / 114 Chapter 7. Process Control, Monitoring, and Incoming Inspection Tim Rodgers 117 7.1 Introduction / 117 7.2 Process Capability and Process Control / 117 7.3 Process Monitoring and Troubleshooting / 122 7.4 Assessing a PCB Fabricators Capability / 122 7.5 Testing and Inspection / 156 7.6 Incoming Inspection / 158 Chapter 8. Product Acceptance and Feedback Tim Rodgers 159 8.1 Introduction / 159 8.2 Design Qualification / 159 8.3 Incoming Inspection and Lot Acceptance / 160 8.4 Supplier Performance Management / 162 8.5 Business Reviews / 165 8.6 Strategic Supplier Management / 167 Part 3: Materials Chapter 9. Introduction to Base Materials Edward Kelley and Douglas Trobough 171 9.1 Introduction / 171 9.2 Grades and Specifications / 171 9.3 Properties Used to Classify Base Materials / 178 9.4 Types of FR-4 / 184 9.5 Laminate Identification Scheme / 185 9.6 Prepreg Identification Scheme / 186 9.7 Laminate and Prepreg Manufacturing Processes / 189 9.8 References / 195 Chapter 10. Base Material Components Edward Kelley and Douglas Trobough 197 10.1 Introduction / 197 10.2 Other Resin Systems / 201 10.3 Legislative Issues / 203 10.4 Additives / 207 10.5 Reinforcements / 209 10.6 Conductive Materials / 217 10.7 References / 224 Chapter 11. Properties of Base Materials Edward Kelley and Douglas Trobough 225 11.1 Introduction / 225 11.2 Thermal, Physical, and Mechanical Properties / 225 11.3 Electrical Properties / 236 11.4 Other Test Methods / 240 11.5 References / 240 Chapter 12. Base Material Performance in PCBs Edward Kelley and Douglas Trobough 241 12.1 Introduction / 241 12.2 Methods of Increasing Circuit Density / 241 12.3 Copper Foil / 242 12.4 Laminate Constructions / 247 12.5 Prepreg Options and Yield-per-Ply Values / 248 12.6 Dimensional Stability / 249 12.7 High-Density Interconnect/Microvia Materials / 250 12.8 Conductive Anodic Filament Growth / 252 12.9 Electrical Performance / 258 12.10 Electrical Performance of Lower Dk/Df Lead-Free Compatible Materials / 268 12.11 Resin and Glass Micro-Dk Effects / 268 12.12 References / 272 Chapter 13. The Impact of Lead-Free Assembly on Base Materials Edward Kelley and Douglas Trobough 273 13.1 Introduction / 273 13.2 RoHS Basics / 273 13.3 Base Material Compatibility Issues / 274 13.4 The Impact of Lead-Free Assembly on Base Material Components / 276 13.5 Critical Base Material Properties / 276 13.6 Impact on Printed Circuit Reliability and Material Selection / 288 13.7 Summary / 292 13.8 Further Reading / 292 Chapter 14. Selecting Base Materials Edward Kelley and Douglas Trobough 293 14.1 Introduction / 293 14.2 Selecting Materials for Thermal Reliability / 293 14.3 Selecting a Base Material for Thermal Reliability / 298 14.4 Selecting Materials for Electrical Performance / 304 14.5 CAF Resistance / 309 14.6 References / 315 Chapter 15. Laminate Qualification and Testing Michael Roesch and Sylvia Ehrler 317 15.1 Introduction / 317 15.2 Industry Standards / 318 15.3 Laminate Test Strategy / 319 15.4 Initial Tests / 321 15.5 Full Material Characterization / 324 15.6 Characterization Test Plan / 335 15.7 Manufacturability in the Shop / 337 Part 4: Engineering and Design Chapter 16. Planning for Design, Fabrication, and Assembly Happy T. Holden 341 16.1 Introduction / 341 16.2 General Considerations / 342 16.3 New Product Design / 343 16.4 Specification: Capture of System Description / 346 16.5 Layout Trade-Off Planning / 349 16.6 PWB Fabrication Trade-Off Planning / 355 16.7 Assembly Trade-Off Planning / 362 16.8 References / 364 Chapter 17. Physical Characteristics of the PCB Lee W. Ritchey 365 17.1 Introduction / 365 17.2 Types of PCBs or Substrates / 366 17.3 Methods of Attaching Components / 369 17.4 Component Package Types / 369 17.5 Materials Choices / 371 17.6 Fabrication Methods / 372 Chapter 18. Electronic Design Automation and Printed Circuit Design Tools Andy Shaughnessy 373 18.1 Description of PCB Design Tools / 373 18.2 Using PCB Design Tools / 374 18.3 Major PCB Design Tools / 376 18.4 Lower-Cost PCB Design Tools / 378 18.5 Free PCB Design Tools / 379 18.6 Signal Integrity and EMC Tools / 381 18.7 Key Questions to Consider / 383 18.8 Further Reading / 383 Chapter 19. The PCB Design Process Lee W. Ritchey 385 19.1 Introduction / 385 19.2 The Virtual Prototyping Process / 387 19.3 Making the Conversion from Hardware Prototyping to Virtual Prototyping / 394 Chapter 20. Electrical and Mechanical Design Parameters Bill Hargin and Mark I. Montrose 395 20.1 Electrical and Mechanical Design Parameters Overview / 395 20.2 Introduction to Digital Signal Integrity / 396 20.3 Which Nets to Terminate and What Type of Termination to Use / 406 20.4 Introduction to Differential Signaling / 415 20.5 Introduction to Power Integrity / 419 20.6 Introduction to Electromagnetic Compatibility / 426 20.7 Introduction to Mechanical Design Requirements / 434 20.8 Types of Edge Mounting for Circuit Boards / 438 20.9 Acknowledgments / 441 20.10 References / 441 Chapter 21. The Basics of Printed Circuit Board Design Susy Webb 443 21.1 Software Selection / 443 21.2 Standards / 443 21.3 The Schematic / 445 21.4 Parts / 446 21.5 Padstacks / 448 21.6 Starting a New Board / 449 21.7 Placement / 453 21.8 Planes / 456 21.9 Stackup / 457 21.10 Routing / 458 21.11 Finishing / 464 21.12 Saving / 466 21.13 Conclusion / 466 Chapter 22. Current Carrying Capacity in Printed Circuits Mike Jouppi 469 22.1 Introduction / 469 22.2 Conductor (Trace) Sizing Charts / 470 22.3 Baseline Charts / 473 22.4 Summary / 480 22.5 References / 480 Chapter 23. PCB Design for Thermal Performance Mike Jouppi 481 23.1 Introduction / 481 23.2 The PCB as a Heat Sink Soldered to the Component / 482 23.3 Optimizing the PCB for Thermal Performance / 482 23.4 Conducting Heat to the Chassis / 490 23.5 PCB Requirements for High-Power Heat Sink Attach / 492 23.6 Modeling the Thermal Performance of the PCB / 493 23.7 Heat Sources / 496 23.8 Acknowledgment / 497 23.9 References / 497 Chapter 24. Embedded Components Vern Solberg 499 24.1 Introduction / 499 24.2 Definitions and Example / 499 24.3 Applications and Trade-Offs / 500 24.4 Designing for Embedded Component Applications / 501 24.5 Materials / 505 24.6 Material Supply Types / 509 24.7 Conclusion / 515 24.8 Acknowledgment / 515 Part: 5 High-Density Interconnection Chapter 25. Introduction to High-Density Interconnection Technology Happy T. Holden 519 25.1 Introduction / 519 25.2 Definit ions / 519 25.3 HDI Structures / 523 25.4 Design / 527 25.5 Dielectric Materials and Coating Methods / 529 25.6 HDI Manufacturing Processes / 541 25.7 Appendix / 549 25.8 References / 550 25.9 Further Reading / 550 Chapter 26. Advanced High-Density Interconnection Technologies Happy T. Holden 551 26.1 Introduction / 551 26.2 Definitions of HDI Process Factors / 551 26.3 HDI Fabrication Processes / 553 26.4 Next-Generation HDI Processes / 572 26.5 References / 578 26.6 Further Reading / 579 Part 6: Fabrication Chapter 27. CAM Tooling for Fab and Assembly Happy T. Holden 583 27.1 Introduction / 583 27.2 Manufacturing Information / 583 27.3 Design Analysis and Review / 585 27.4 The CAM-Tooling Process / 586 27.5 Additional Processes / 597 27.6 Acknowledgments / 600 Chapter 28. Drilling Processes Matthias Stickel 601 28.1 Introduction / 601 28.2 Materials / 602 28.3 Machines / 608 28.4 Methods / 612 28.5 Hole Quality / 618 28.6 Troubleshooting / 619 28.7 Postdrilling Inspection / 621 28.8 Drilling Cost per Hole / 621 28.9 Acknowledgment / 624 Chapter 29. Precision Interconnect and Laser Drilling Matthias Stickel 625 29.1 Introduction / 625 29.2 Factors Affecting High-Density Drilling / 625 29.3 Laser versus Mechanical / 626 29.4 Factors Affecting High-Density Mechanical Drilling / 629 29.5 Depth-Controlled Drilling Methods / 633 29.6 Controlled Depth Via Drilling / 633 29.7 Innerlayer Registration of Multilayer Boards / 637 29.8 Laser Drilling / 637 29.9 Laser Via Formation / 639 29.10 Laser Tool Types / 639 29.11 Acknowledgment / 640 29.12 Further Reading / 640 Chapter 30. Imaging and Automated Optical Inspection Gareth Parry 641 30.1 Introduction / 641 30.2 Photosensitive Materials / 641 30.3 Dry-Film Resists / 644 30.4 Liquid Photoresists / 646 30.5 Electrophoretic Depositable Photoresists / 647 30.6 Resist Processing / 648 30.7 Design for Manufacturing / 665 30.8 Inkjet Imaging / 667 30.9 Automatic Optical Inspection / 668 30.10 References / 668 Chapter 31. Multilayer Materials and Processing C. D. (Don) Dupriest and Happy T. Holden 671 31.1 Introduction / 671 31.2 Multilayer Construction Types / 672 31.3 ML-PWB Processing and Flows / 690 31.4 Lamination Process / 697 31.5 Lamination Process Control and Troubleshooting / 704 31.6 Lamination Overview / 706 31.7 ML-PWB Summary / 707 31.8 Acknowledgment / 708 31.9 Further Reading / 708 Chapter 32. Preparing Boards for Plating Michael Carano 709 32.1 Introduction / 709 32.2 Process Decisions / 709 32.3 Process Feedwater / 711 32.4 Multilayer PTH Preprocessing / 713 32.5 Electroless Copper / 717 32.6 Acknowledgments / 719 32.7 References / 719 Chapter 33. Electroplating George Milad 721 33.1 Introduction / 721 33.2 Electroplating Basics / 721 33.3 Acid Copper Electroplating / 722 33.4 Tin Electroplating / 735 33.5 Nickel Electroplating / 736 33.6 Gold Electroplate / 739 Chapter 34. Direct Plating Hayao Nakahara 743 34.1 Direct Metallization Technology / 743 34.2 References / 753 Chapter 35. Printed Circuit Board Surface Finishes George Milad 755 35.1 Introduction / 755 35.2 PWB Surface Finishes / 757 35.3 Hot Air Solder Level / 758 35.4 Electroless Nickel Immersion Gold / 758 35.5 Nickel Palladium Gold / 761 35.6 Organic Solderability Preservatives / 763 35.7 Immersion Silver / 765 35.8 Immersion Tin / 766 35.9 Other Surface Finishes / 767 Chapter 36. Solder Mask David A. Vaughan 771 36.1 Introduction / 771 36.2 Trends and Challenges for Solder Mask / 772 36.3 Types of Solder Mask / 773 36.4 Solder Mask Selection / 774 36.5 Solder Mask Application and Processing / 778 36.6 Via Protection / 785 36.7 Solder Mask Final Properties / 786 36.8 Legend and Marking (Nomenclature) / 787 Chapter 37. Etching Process and Technologies Gareth Parry 789 37.1 Introduction / 789 37.2 General Etching Considerations and Procedures / 790 37.3 Resist Removal / 792 37.4 Etching Solutions / 793 37.5 Other Materials for Board Construction / 804 37.6 Metals Other than Copper / 805 37.7 Basics of Etched Line Formation / 806 37.8 Equipment and Techniques / 811 37.9 Acknowledgment / 814 37.10 References / 814 Chapter 38. Routing and V-Scoring Matthias Stickel 817 38.1 Introduction / 817 38.2 The Routing Operation / 817 38.3 Materials / 821 38.4 Machines / 822 38.5 Routers / 824 38.6 Parameters / 825 38.7 Depth Controlled Routing / 827 38.8 V-Scoring / 828 38.9 References / 831 Part 7: Bare Board Test Chapter 39. Bare Board Test Objectives and Definitions David J. Wilkie 835 39.1 Introduction / 835 39.2 The Impact of HDI / 835 39.3 Why Test? / 836 39.4 Circuit Board Faults / 838 Chapter 40. Bare Board Test Methods David J. Wilkie 841 40.1 Introduction / 841 40.2 Nonelectrical Testing Methods / 841 40.3 Basic Electrical Testing Methods / 842 40.4 Specialized Electrical Testing Methods / 848 40.5 Data and Fixture Preparation / 851 40.6 Combined Testing Methods / 857 Chapter 41. Bare Board Test Equipment David J. Wilkie 859 41.1 Introduction / 859 41.2 System Alternatives / 859 41.3 Universal Grid Systems / 861 41.4 Flying-Probe/Moving-Probe Test Systems / 872 41.5 Verification and Repair / 876 41.6 Test Department Planning and Management / 876 Chapter 42. HDI Bare Board Special Testing Methods David J. Wilkie 879 42.1 Introduction / 879 42.2 Fine-Pitch Tilt-Pin Fixtures / 880 42.3 Bending Beam Fixtures / 880 42.4 Flying Probe / 881 42.5 Coupled Plate / 881 42.6 Shorting Plate / 881 42.7 Conductive Rubber Fixtures / 882 42.8 Optical Inspection / 882 42.9 Noncontact Test Methods / 882 42.10 Combinational Test Methods / 884 Part 8: Assembly, Soldering Materials, and Processes Chapter 43. Assembly Processes Happy T. Holden 887 43.1 Introduction / 887 43.2 Through-Hole Technology / 889 43.3 Surface-Mount Technology / 899 43.4 Odd-Form Component Assembly / 923 43.5 Process Equipment Selection / 930 43.6 Conformal Coating, Encapsulation, and Underfill Materials / 933 43.7 Acknowledgments / 934 Chapter 44. Conformal Coating Jason Keeping 935 44.1 Introduction / 935 44.2 Types of Conformal Coatings / 936 44.3 Product Preparation / 940 44.4 Application Processes / 946 44.5 Cure, Inspection, and Demasking / 949 44.6 Repair Methods / 951 44.7 Design for Conformal Coating / 952 44.8 References / 955 Chapter 45. Fluxes and Cleaning Gregory C. Munie and Laura J. Turbini 957 45.1 Introduction / 957 45.2 Assembly Process / 958 45.3 Surface Finishes / 959 45.4 Soldering Flux / 960 45.5 Flux Form versus Soldering Process / 961 45.6 Rosin Flux / 962 45.7 Water-Soluble Flux / 963 45.8 Low Solids Flux / 964 45.9 Cleaning Issues / 965 45.10 Summary / 967 45.11 References / 967 Chapter 46. Soldering Fundamentals Gary M. Freedman 969 46.1 Introduction / 969 46.2 Elements of a Solder Joint / 970 46.3 Solder Overview / 971 46.4 Soldering Basics / 971 46.5 References / 975 Chapter 47. Soldering Materials and Metallurgy Gary M. Freedman 977 47.1 Introduction / 977 47.2 Solders / 978 47.3 Solder Alloys and Corrosion / 980 47.4 Pb-Free Solders: Alternatives and Implications / 980 47.5 Board Surface Finishes / 986 47.6 References / 994 Chapter 48. Solder Fluxes Gary M. Freedman 997 48.1 Introduction to Fluxes / 997 48.2 Flux Functions / 997 48.3 Flux Delivery Methods / 999 48.4 Flux Activity and Attributes / 999 48.5 Flux: Ideal versus Reality / 1000 48.6 Flux Types / 1000 48.7 Soldering Atmospheres / 1009 48.8 References / 1012 Chapter 49. Soldering Techniques Gary M. Freedman 1015 49.1 Introduction / 1015 49.2 Mass Soldering Methods / 1015 49.3 Oven Reflow Soldering / 1015 49.4 Wave Soldering / 1039 49.5 Wave Solder Defects / 1054 49.6 Vapor-Phase Reflow Soldering / 1055 49.7 Laser Reflow Soldering / 1057 49.8 Hot-Bar Soldering / 1064 49.9 Hot-Gas Soldering / 1069 49.10 Ultrasonic Soldering / 1071 49.11 References / 1072 Chapter 50. Soldering Repair and Rework Gary M. Freedman 1075 50.1 Introduction / 1075 50.2 Hot-Gas Repair / 1075 50.3 Manual Solder Fountain / 1080 50.4 Automated Solder Fountain (Single-Point Soldering) / 1080 50.5 Laser / 1080 50.6 Considerations for Repair / 1081 50.7 Reference / 1082 Part 9: Nonsolder Interconnection Chapter 51. Press-Fit Interconnection Gary M. Freedman 1085 51.1 Introduction / 1085 51.2 The Rise of Press-Fit Technology / 1086 51.3 Compliant Pin Configurations / 1086 51.4 Press-Fit Considerations / 1089 51.5 Press-Fit Pin M aterials / 1089 51.6 Surface Finishes and Effects / 1090 51.7 Equipment / 1093 51.8 Assembly Process / 1093 51.9 Rework for Press-Fit Connectors / 1096 51.10 PCB Design and Board Procurement Tips / 1098 51.11 Press-Fit Process Tips / 1099 51.12 Further Reading / 1101 Chapter 52. Pressure-Interconnect Land Grid Array Systems Gary M. Freedman 1103 52.1 Introduction / 1103 52.2 LGA and the Environment / 1103 52.3 Elements of the LGA System / 1103 52.4 Assembly / 1107 52.5 PCA Rework / 1109 52.6 Design Guidelines / 1110 52.7 Reference / 1110 Part 10: Quality Chapter 53. Acceptability and Quality of Fabricated Boards Robert (Bob) Neves 1113 53.1 Introduction / 1113 53.2 Specific Quality and Acceptability Criteria by PCB Type / 1114 53.3 Methods for Verification of Acceptability / 1115 53.4 Inspection Lot Formation / 1116 53.5 Inspections Categories / 1117 53.6 Acceptability and Quality After Simulated Solder Cycle(s) / 1118 53.7 Nonconforming PCBs and Material Review Board Function / 1120 53.8 The Cost of the Assembled PCB / 1120 53.9 How to Develop Acceptability and Quality Criteria / 1121 53.10 Class of Service / 1122 53.11 Inspection Criteria / 1123 53.12 Reliability Inspection Using Accelerated Environmental Exposure / 1142 Chapter 54. Acceptability of Printed Circuit Board Assemblies Mel Parrish 1145 54.1 Understanding Customer Requirements / 1145 54.2 Handling to Protect the PCBA / 1150 54.3 PCBA Hardware Acceptability Considerations / 1153 54.4 Component Installation or Placement Requirements / 1158 54.5 Component and PCB Solderability Requirements / 1166 54.6 Solder-Related Defects / 1166 54.7 PCBA Laminate Condition, Cleanliness, and Marking Requirements / 1171 54.8 PCBA Coatings / 1174 54.9 Solderless Wrapping of Wire to Posts (Wire Wrap) / 1175 54.10 PCBA Modifications / 1176 54.11 References / 1178 Chapter 55. Asssembly Inspection Stacy Kalisz Johnson and Stig Oresjo 1179 55.1 Introduction / 1179 55.2 Definition of Defects, Faults, Process Indicators, and Potential Defects / 1181 55.3 Reasons for Inspection / 1182 55.4 Lead-Free Impact on Inspection / 1184 55.5 Miniaturization and Higher Complexity / 1185 55.6 Visual Inspection / 1186 55.7 Automated Inspection / 1189 55.8 Three-Dimensional Automated Solder Paste Inspection / 1191 55.9 Pre-Reflow AOI / 1193 55.10 Post-Reflow Automated Inspection / 1194 55.11 Implementation of Inspection Systems / 1199 55.12 Design Implications of Inspection Systems / 1200 55.13 References / 1201 Chapter 56. Design for Testing Kenneth P. Parker 1203 56.1 Introduction / 1203 56.2 Definitions / 1204 56.3 Ad Hoc Design for Testability / 1204 56.4 Structured Design for Testability / 1206 56.5 Standards-Based Testing / 1207 56.6 References / 1213 Chapter 57. Loaded Board Testing Kenneth P. Parker 1215 57.1 Introduction / 1215 57.2 The Process of Test / 1216 57.3 Definitions / 1217 57.4 Testing Approaches / 1221 57.5 In-Circuit Test Techniques / 1224 57.6 Alternatives to Conventional Electrical Tests / 1229 57.7 Tester Comparison / 1232 57.8 References / 1232 Chapter 58. Failure Modes and Effects Analysis Happy T. Holden 1233 58.1 Prognostics and Health Management / 1233 58.2 Theory / 1235 58.3 What Is Process FMEA? / 1241 58.4 Reference / 1244 58.5 Further Reading / 1244 Part 11: Reliability Chapter 59. Conductive Anodic Filament Formation Laura J. Turbini and Antonio Caputo 1247 59.1 Introduction / 1247 59.2 Electrochemical Migration / 1247 59.3 Developing a Quantitative Copper Corrosion Test / 1249 59.4 Understanding CAF Formation / 1256 59.5 Factors That Affect CAF Formation / 1260 59.6 Test Method for CAF-Resistant Materials / 1266 59.7 Manufacturing Tolerance Considerations / 1267 59.8 References / 1267 Chapter 60. Reliability of Printed Circuit Boards Reza Ghaffarian 1271 60.1 Introduction / 1271 60.2 PCB and Microelectronics Trends and Reliability / 1272 60.3 PCB Fabrication and Failure Mechanisms / 1283 60.4 PTH Thermal Cycle Reliability and Projections Methods / 1294 60.5 Acknowledgments / 1322 60.6 References / 1322 60.7 Further Reading / 1325 Chapter 61. Reliability of Microvia Printed Circuit Boards Reza Ghaffarian 1327 61.1 Microvia Fabrication / 1327 61.2 Summary / 1342 61.3 List of Acronyms / 1342 61.4 Acknowledgments / 1345 61.5 References / 1345 61.6 Further Reading / 1346 Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free Mudasir Ahmad and Mark Brillhart 1347 62.1 Introduction / 1347 62.2 Packaging Challenges / 1348 62.3 Variables That Impact Reliability / 1351 62.4 References / 1373 Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules Jean-Paul Clech 1375 63.1 Introduction / 1375 63.2 Reliability Definition and Goals / 1376 63.3 Why Do Solder Joints Fail? / 1377 63.4 Main Effects and Basic Rules-of-Thumb / 1378 63.5 Parameters That Affect Solder Joint Reliability Under Thermal Cycling Conditions / 1384 63.6 Significance of Board Parameter Effects / 1387 63.7 Lead-Free Reliability Trends / 1393 63.8 Conclusions / 1397 63.9 Further Reading / 1397 Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders Mudasir Ahmad and Mark Brillhart 1401 64.1 Introduction / 1401 64.2 Thermomechanical Reliability / 1403 64.3 Mechanical Reliability / 1418 64.4 Finite Element Analysis / 1425 64.5 References / 1432 Part 12: Flexible Circuits Chapter 65. Flexible Circuit Applications and Materials Happy T. Holden 1439 65.1 Introduction to Flexible Circuits / 1439 65.2 Applications of Flexible Circuits / 1441 65.3 High-Density Flexible Circuits / 1442 65.4 Materials for Flexible Circuits / 1443 65.5 Substrate Material Properties / 1445 65.6 Conductor Materials / 1459 65.7 Copper-Clad Laminates / 1460 65.8 Coverlay Materials / 1464 65.9 Stiffener Materials / 1469 65.10 Adhesive Materials / 1469 65.11 Restriction of Hazardous Substances Issues / 1470 65.12 Acknowledgments / 1470 Chapter 66. Design of Flexible Circuits Happy T. Holden 1471 66.1 Introduction / 1471 66.2 Types of Flexible Circuits / 1472 66.3 Multilayer Rigid Flex (Multilayer Flex) / 1478 66.4 Circuit Designs for Flexibility / 1480 66.5 Electrical Design of the Circuits / 1485 66.6 Design of Flexible Printed Wiring with Transmission Line Properties / 1490 66.7 Circuit Designs for Higher Reliability / 1500 66.8 Acknowledgments / 1502 Chapter 67. Manufacturing Flexible Circuits Joseph Fjelstad 1503 67.1 Introduction / 1503 67.2 Fundamental Flex Circuit Processing Steps / 1504 67.3 Equipment for Wet Processing of Flexible Materials / 1507 67.4 Coverlayer/Cover-Coating Methods / 1509 67.5 Interconnection Surface Treatments / 1516 67.6 Depanelization of Flexible Circuits / 1517 67.7 Stiffener Processes / 1519 67.8 Packaging for Flex / 1520 67.9 High-Density Flexible Circuit Manufacturing / 1520 67.10 Acknowledgments / 1529 Chapter 68. Termination Options for Flexible Circuits Joseph Fjelstad 1531 68.1 Introduction / 1531 68.2 Wirebonding Technology / 1533 68.3 Solutions Where the Flex Circuit Is Half of the Mated Pair / 1536 68.4 Summary / 1541 68.5 Acknowledgments / 1541 Chapter 69. Multilayer Flex and Rigid Flex Joseph Fjelstad 1543 69.1 Introduction / 1543 69.2 Multilayer Flex versus Rigid Flex / 1543 69.3 Aluminum Rigid Flex Circuit—Prospective Structure for the Future / 1550 69.4 Summary / 1554 69.5 Acknowledgments / 1555 Chapter 70. Special Constructions of Flexible Circuits Dominique K. Numakura 1557 70.1 Introduction / 1557 70.2 Flying-Lead Construction / 1557 70.3 Tape Automated Bonding / 1564 70.4 Microbump Arrays / 1566 70.5 Thick-Film Conductor Flex Circuits / 1568 70.6 Shielding of the Flexible Cables / 1569 70.7 Functional Flexible Circuits / 1570 Chapter 71. Flexible Circuit Quality Assurance: Principles and Practices Joseph Fjelstad 1573 71.1 Introduction / 1573 71.2 Basic Concepts in Flexible Circuit Quality Assurance / 1574 71.3 Raw Material Testing / 1575 71.4 Electrical Performance Tests / 1576 71.5 General Testing Requirements for Flexible Circuit Materials / 1577 71.6 Flexible Circuit Visual Evaluation / 1577 71.7 Flexible Circuit Dimensional Requirements / 1578 71.8 Physical Testing Requirements for Flexible Circuits / 1579 71.9 Electrical Requirements for Flexible Circuits / 1581 71.10 Environmental Resistance Requirements / 1582 71.11 Solderability Requirements / 1582 71.12 Standards and Specifications for Flexible Circuits / 1582 71.13 Summary / 1584 71.14 Acknowledgments / 1584 Appendix: Summary of Key Component, Material, Process, and Design Standards Marc Carter 1585 Glossary 1595 Index 1605

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Clyde F. Coombs, Jr, (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronics Instrument Handbook and the communications Network Test and Measurement Handbook.

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