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OverviewThe design of printed circuit assemblies and boards has been radically affected by today's faster and smaller electronics applications and the many new packaging and interconnection strategies these applications require. This engineering design text provides a complete ""roadmap"" to printed circuit assembly design. It covers both electrical and mechanical design considerations, as well as processes, tools and documentation. Full Product DetailsAuthor: Leonard Marks , James CaterinaPublisher: McGraw-Hill Education - Europe Imprint: McGraw-Hill Professional Dimensions: Width: 16.30cm , Height: 3.70cm , Length: 23.60cm Weight: 0.737kg ISBN: 9780070411074ISBN 10: 0070411077 Pages: 368 Publication Date: 16 August 2000 Audience: College/higher education , Tertiary & Higher Education Format: Hardback Publisher's Status: Out of Print Availability: Out of stock  Table of ContentsChapter 1: Introduction. Chapter 2: Key Factors Influencing Design. Chapter 3: Design Process Flow. Chapter 4: Circuit Board Layout. Chapter 5: Design Quality. Chapter 6: Documentation. Chapter 7: Design Revisions. Chapter 8: Design Organization and Management. Appendix A: Glossary. Appendix B: CCA Failure Mechanisms and Reliability Issues.ReviewsAuthor InformationLeonard Marks has over 35 years of aerospace and commercial industry experience in printed circuit assembly design and manufacturing. He was a pioneer in the use of computer-aided systems for circuit board layout, and has implemented and managed CAE/CAD/CAM systems at several major corporations. Mr. Marks’ manufacturing background includes installation and operation of state-of-the-art circuit board fabrication, assembly and test facilities at three different sites. Mr. Marks served on the board of directors of the International Microelectronics and Packaging Society, and was on the staff of Electronic Packaging and Production Magazine as contributing editor. He is a graduate of the Polytechnic University of New York. James A. Caterina has over 28 years of experience designing printed circuit assemblies for several major military and industrial electronics manufacturing companies. He is manager of the printed circuit design group at Northrop Grumman’s Illinois facility. Mr. Caterina has contributed to the development of several IPC standards. Tab Content 6Author Website:Countries AvailableAll regions |
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