Overview

Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.

Full Product Details

Author:   Qinghuang Lin (Research Staff Member, Research Staff Member, IBM T. J. Watson Research Center) ,  Raymond A. Pearson (Associate Professor of Materials Science and Engineering, Associate Professor of Materials Science and Engineering, Lehigh University) ,  Jeffrey C. Hedrick (Manager, Technical Research Strategy, Manager, Technical Research Strategy, IBM T. J. Watson Research Center)
Publisher:   Oxford University Press Inc
Imprint:   Oxford University Press Inc
Volume:   874
Dimensions:   Width: 16.00cm , Height: 2.20cm , Length: 23.60cm
Weight:   0.546kg
ISBN:  

9780841238572

ISBN 10:   084123857
Pages:   352
Publication Date:   29 April 2004
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   No Longer Our Product
Availability:   In Print  
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Table of Contents

Preface 1: Zhenan Bao: Recent Progress in Materials for Organic Electronics 2: Kyungkon Kim, Guolun Zhong, Jung-Il Jin, Jung Ho Park, Seoung Hyun Lee, Dong Woo Kim, Yung Woo Park, and Whikun Yi: PPV Nanotubes, Nanorods, and Nanofilms as well as Carbonized Objects Derived Therefrom 3: M.E. van der Boom and T.J. Marks: Layer-by-Layer Assembly of Molecular Materials for Electrooptical Applications 4: Sung-Yeon Jang, Manuel Marquez, and Gregory A. Sotzing: Oxidative Solid-State Cross-Linking of Polymer Precursors to Pattern Intrinsically Conducting Polymers 5: T.H. Fedynyshyn, W.A. Mowers, R.R. Kunz, R.F. Sinta, M. Sworin, A. Cabral, and J. Curtin: Fluorocarbon Polymer-Based Photoresists for 157-nm Lithography 6: Toshiro Itani, Hiroyuki Watanabe, Tamio Yamazaki, Seichi Ishikawa, Naomi Shida, and Minoru Toriumi: 157-nm Resist Materials Using Main-Chain Fluorinated Polymers 7: Ronald L. Jones, Vivek M. Prabhu, Dario L. Goldfarb, Eric K. Lin, Christopher L. Soles, Joseph L. Lenhart, Wen-li Wu, and Marie Angelopoulos: Correlation of the Reaction Front with Roughness in Chemically Amplified Photoresists 8: Joseph L. Lenhart, Daniel A. Fischer, Sharadha Sambasivan, Eric K. Lin, Christopher L. Soles, Ronald L. Jones, Wen-li Wu, Dario L. Goldfarb, and Marie Angelopoulos: Utilizing Near Edge X-ray Absorption Fine Structure to Probe Interfacial Issues in Photolithography 9: B. Voit, F. Braun, Ch. Loppacher, S. Trogisch, L.M. Eng, R. Seidel, A. Gorbunoff, W. Pompe, and M. Mertig: Photolabile Ultrathin Polymer Films for Spatially Defined Attachment of Nano Elements 10: Martin Brehmer, Lars Conrad, Lutz Funk, Dirk Allard, Patrick Theato, and Anke Helfer: Soft Lithography on Block Copolymer Films: Generating Functionalized Patterns on Block Copolymer Films as a Basis to Further Surface Modification 11: R.D. Miller, W. Volksen, V.Y. Lee, E. Conner, T. Magbitang, R. Zafran, L. Sundberg, C.J. Hawker, J.L. Hedrick, E. Huang, M. Tooney, Q.R. Huang, C.W. Frank, and H.-C. Kim: Nanoporous, Low-Dielectric Constant Organosilicate Materials Derived from Inorganic Polymer Blends 12: C. Tyberg, E. Huang, J. Hedrick, E. Simonyi, S. Gates, S. Cohen, K. Malone, H. Wickland, M. Sankarapandian, M. Toney, H.-C. Kim, R. Miller, W. Volksen, P. Rice, and L. Lurio: Porous Low-k Dielectrics: Material Properties 13: Bianxiao Zhong and Eric S. Moyer: Ultra Low-k Dielectic Films with Ultra Small Pores Using Poragens Chemically Bonded to Silozane Resin 14: H. Craig Silvis, Kevin J. Bouck, James P. Godschalx, Q. Jason Niu, Michael J. Radler, Ted M. Stokich, John W. Lyons, Brandon J. Kern, Joan G. Marshall, Karin Syverud, and Mary Leff: Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices 15: Q. Jason Niu, Steven J. Martin, James P. Godschalx, and Paul H. Townsend: Molecular Brushes as Templating Agents for Nanoporous SiLK* Dielectric Films 16: Christopher L. Soles, Hae-Jeong Lee, Ronald C. Hedden, Da-wei Liu, Barry J. Bauer, and Wen-li Wu: X-ray Reflectivity as a Metrology to Characterize Pores in Low-k Dielectric Films 17: Sara N. Paisner and Joseph M. DeSimone: Micro- and Nanoporous Materials Developed Using Supercritical CO2: Novel Synthetic Methods for the Development of Micro- and Nanoporous Materials Toward Microelectronic Applications 18: Masamitsu Shirai, Satoshi Morishita, Akiya Kawaue, Haruyuki Okamura, and Masahiro Tsunooka: Thermally Degradable Photocross-Linking Polymers 19: Robert K. Oldak and Raymond A. Pearson: Evaluation of Infrared Spectroscopic Techniques to Assess Molecular Interactions 20: Zhuqing Zhang and C.P. Wong: Study on Metal Chelates as Catalysts of Epoxy and Anhydride Cure Reactions for No-Flow Underfill Applications 21: Ying-Hung So, Phil E. Garrou, Jang-Hi Im, and Karou Ohba: Benzocyclobutene-Based Polymers for Microelectronic Applications 22: A.L.Cholli, S.K. Sahoo, D.W. Kim, J. Kumar, and A. Blumstein: Formation of Nanocomposites by In Situ Intercalative Polymerization of 2-Ethynylpyrdine in Layered Aluminosilicates: A Solid-State NMR Study Author Index Subject Index

Reviews

<br> Each chapter is well-illustrated and well-referenced and can certainly serve to orient the scientist or engineer to these new developments. This is a book that practising micro-engineers will want to have as a reference. -- Materials World<p><br>

Each chapter is well-illustrated and well-referenced and can certainly serve to orient the scientist or engineer to these new developments. This is a book that practising micro-engineers will want to have as a reference. -- Materials World<br>

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