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Author:   Seda Ogrenci-Memik (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA)
Publisher:   Institution of Engineering and Technology
Imprint:   Institution of Engineering and Technology
Dimensions:   Width: 15.60cm , Height: 2.00cm , Length: 23.40cm
Weight:   0.590kg
ISBN:  

9781849199346

ISBN 10:   1849199345
Pages:   264
Publication Date:   December 2015
Audience:   College/higher education ,  Professional and scholarly ,  Tertiary & Higher Education ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Chapter 1: Heat in integrated circuits and systemsChapter 2: On-chip temperature sensingChapter 3: Dynamic thermal managementChapter 4: Active coolingChapter 5: Mitigating thermal events at the system level and aboveChapter 6: Emerging directions in thermal-aware systemsAppendix A: Relevant units and metrics

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Author Information

Seda Ogrenci-Memik is an Associate Professor at the Electrical Engineering and Computer Science Department of Northwestern University, Illinois, where her research interests include thermal-aware design and management of high performance systems, embedded and reconfigurable computing, and thermal sensing technologies. Dr Ogrenci-Memik has served as technical program chair, committee member, organizing committee member, and track chair of several conferences, including ICCAD, DAC, DATE, EUC, FPL, GLSVLSI, and ISVLSI and she has served on the Editorial Board of IEEE Transactions on VLSI.

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