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OverviewFull Product DetailsAuthor: Ernest Kuh (Univ Of California, Berkeley, Usa)Publisher: World Scientific Publishing Co Pte Ltd Imprint: World Scientific Publishing Co Pte Ltd ISBN: 9789810209254ISBN 10: 9810209258 Pages: 156 Publication Date: 01 March 1992 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsSi-on-Si multichip module technology and its applications, K.L. Tai; early assessment of design, packaging and technology tradeoffs, D. Lapotin; design automation for MCM - issues and status, P. Chan; the VAX 9000 multichip packaging and its evolution to future high end computer applications, C.W. Ho; performance driven layout for thin-film multichip modules, W-M. Dai; transient simulation of lossy coupled transmission lines characterized with frequency-dependent parameters, O. Wing and F-Y. Chang.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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