Microvias: For Low Cost, High Density Interconnects
Author:   John H Lau ,  Ricky S Lee
Publisher:   McGraw-Hill Companies
ISBN:  

9786610913367


Publication Date:   01 January 2001
Format:   Electronic book text
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Microvias: For Low Cost, High Density Interconnects


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Overview

A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size.

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Author:   John H Lau ,  Ricky S Lee
Publisher:   McGraw-Hill Companies
Imprint:   McGraw-Hill Companies
ISBN:  

9786610913367


ISBN 10:   6610913366
Publication Date:   01 January 2001
Audience:   General/trade ,  General
Format:   Electronic book text
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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