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OverviewAdvances in the semiconductor technology have enabled steady, exponential im- provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni- tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result- ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de- termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore- flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon- nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films. Full Product DetailsAuthor: Y. Sungtaek Ju , Kenneth E. GoodsonPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 1999 Volume: 6 Dimensions: Width: 15.50cm , Height: 0.60cm , Length: 23.50cm Weight: 0.207kg ISBN: 9781461373742ISBN 10: 1461373743 Pages: 102 Publication Date: 02 November 2012 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of Contents1 Introduction.- 1.1 Thermal Issues in Integrated Circuit Elements.- 1.2 Scope of Research.- 1.3 Book Overview.- 2 Review of Microscale Thermometry Techniques.- 2.1 Electrical Methods.- 2.2 Optical Methods.- 3 High Spatial and Temporal Resolution Thermometry.- 3.1 Thermoreflectance Thermometry Technique.- 3.2 Thermal Characterization of Silicon-on-Insulator High-Voltage Transistors.- 3.3 Thermal Characterization of Interconnects.- 4 Thermal Properties of Amorphous Dielectric Films.- 4.1 Thermal Characterization Techniques for Dielectric Films.- 4.2 Heat Transport in Amorphous Silicon Dioxide.- 5 Heat Conduction in Crystalline Silicon Films.- 5.1 Phonon Dispersion and its Implication on the Estimation of the Phonon Mean Free Path.- 5.2 Measurements of In-Plane Thermal Conductivities of Silicon Films.- 5.3 Heat Conduction in Semiconductors at High Temperatures.- 5.4 Prediction of the In-Plane Thermal Conductivity of Silicon Thin Films.- 5.5 Simplified Phonon Transport Equations Accounting for Phonon Dispersion.- 5.6 Hot Phonon Effects.- 6 Summary and Recommendations.- 6.1 Atomistic Simulations of Heat Transport.- 6.2 Thermal Conductivities of Nanostructures.- 6.3 Detailed Simulations of Semiconductor Device.- A Uncertainty Analysis.- A.1 Uncertainly in the Temperature Rise.- A.2 Uncertainly in the Thermal Properties of Dielectric Films.- A.3 Uncertainly in the In-Plane Thermal Conductivity of Thin Films.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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