Microelectronics Packaging Handbook: Semiconductor Packaging

Author:   R.R. Tummala ,  Eugene J. Rymaszewski ,  Alan G. Klopfenstein
Publisher:   Chapman and Hall
Edition:   2nd ed. 1997
ISBN:  

9780412084416


Pages:   1030
Publication Date:   31 January 1997
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Microelectronics Packaging Handbook: Semiconductor Packaging


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Author:   R.R. Tummala ,  Eugene J. Rymaszewski ,  Alan G. Klopfenstein
Publisher:   Chapman and Hall
Imprint:   Chapman and Hall
Edition:   2nd ed. 1997
Dimensions:   Width: 15.50cm , Height: 5.50cm , Length: 23.50cm
Weight:   1.748kg
ISBN:  

9780412084416


ISBN 10:   0412084414
Pages:   1030
Publication Date:   31 January 1997
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997


'A most comprehensive book set, both well presented and well illustrated.' IEEE Electrical Insulation Magazine, September/October 1997


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