Overview

Providing recent advances in microelectronics design methods, modelling tools, simulation techniques and manufacturing processes, this work discusses packages that meet the power, cooling, protection and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

Full Product Details

Author:   R.R. Tummala ,  Eugene J. Rymaszewski ,  Alan G. Klopfenstein
Publisher:   Chapman and Hall
Imprint:   Chapman and Hall
Edition:   2nd ed. 1998
Dimensions:   Width: 17.70cm , Height: 3.30cm , Length: 17.90cm
Weight:   0.296kg
ISBN:  

9780412085611

ISBN 10:   0412085615
Pages:   1000
Publication Date:   31 March 1998
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   CD-ROM
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Volume I: Microelectronics packaging design overview. Package wiring and terminals. Package electrical design. Heat transfer in electronic packages. Package reliability. package manufacture and assembly. Volume II: Microelectronics first-level package overview. Chip-to-package interconnection. Plastic packaging. Ceramic packaging. Polymers in packaging. Thin-film packaging. First level package electrical testing. Package sealing and encapsulation. Volume III: Microelectronics second-level and higher package overview. Package-to-board interconnections. Printed-circuit board packaging. Wiring. Coated-metal packaging. Connector and cable packaging. Optical packaging

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