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OverviewThis is an introductory level book on the fundamentals of microelectronics packaging geared toward students, technicians, and electrical and electronic engineers who need a solid reference on the basics of microelectronics packaging and design. Culled from 12 chapters in the 3-volume Microelectronics Packaging Handbook, Third Edition, it is appropriate both as a reference for those already engaged in packaging design, first and second level packages and their interconnections, test, assembly, thermal management, optoelectronics, reliability, and manufacturing. Full Product DetailsAuthor: R. R. Tummala , E.J. Rymaszewski , A.G. KlopfensteinPublisher: Chapman and Hall Imprint: Chapman and Hall ISBN: 9780412149016ISBN 10: 041214901 Pages: 864 Publication Date: March 1998 Audience: College/higher education , Professional and scholarly , Undergraduate , Postgraduate, Research & Scholarly Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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