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OverviewA collection of papers on microelectronic manufacturing yield, reliability, and failure. It discusses advanced failure analysis, simulation, and packaging-related reliability issues, among other topics. Full Product DetailsAuthor: Hartmann , Hans-Dieter Hartmann , Tohru TsujidePublisher: SPIE Press Imprint: SPIE Press Volume: Vol 3510 Dimensions: Width: 21.40cm , Height: 1.40cm , Length: 27.30cm Weight: 0.576kg ISBN: 9780819429698ISBN 10: 0819429694 Pages: 248 Publication Date: 30 September 1998 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: To order Stock availability from the supplier is unknown. We will order it for you and ship this item to you once it is received by us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |