Microelectronic Applications of Chemical Mechanical Planarization

Author:   Yuzhuo Li
Publisher:   John Wiley & Sons Inc
ISBN:  

9780471719199


Pages:   760
Publication Date:   13 November 2007
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Microelectronic Applications of Chemical Mechanical Planarization


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Overview

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Full Product Details

Author:   Yuzhuo Li
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-Interscience
Dimensions:   Width: 15.50cm , Height: 4.30cm , Length: 23.60cm
Weight:   1.202kg
ISBN:  

9780471719199


ISBN 10:   0471719196
Pages:   760
Publication Date:   13 November 2007
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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YUZHUO LI is a tenured professor in the Department of Chemistry and a member of the Center for Advanced Materials Processing (CAMP) at Clarkson University in Potsdam, New York. He is a member of the American Chemical Society, Chinese American Chemical Society, Materials Research Society, and The Electrochemical Society. He also holds guest professorships at several Chinese universities, including Yangzhou University and Sun Yat-Sen University.

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