Micro Electronic Packing Technology: Materials and Processes
Author:   W.T. Shieh
Publisher:   ASM International
ISBN:  

9780871703590


Pages:   496
Publication Date:   01 January 1989
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Our Price $158.20 Quantity:  
Add to Cart

Share |

Micro Electronic Packing Technology: Materials and Processes


Add your own review!

Overview

Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

Full Product Details

Author:   W.T. Shieh
Publisher:   ASM International
Imprint:   ASM International
ISBN:  

9780871703590


ISBN 10:   0871703599
Pages:   496
Publication Date:   01 January 1989
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

Reviews

Author Information

Tab Content 6

Author Website:  

Customer Reviews

Recent Reviews

No review item found!

Add your own review!

Countries Available

All regions
Latest Reading Guide

lgn

al

Shopping Cart
Your cart is empty
 Shopping cart
Mailing List

 

Sign up now