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OverviewMulti-chip modules (MCMs) with high wiring density, controlled impedance interconnects and thermal management capability have been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity, highlighting recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed for finer resolution thick film inks and high performance-low temperature dielectric tapes. Precision via generation by both laser and mechanical methods and enhanced screen printing technologies have provided feature resolution to the 50 mmm line/space level. MCM-C technology is compatible with thick film sensors and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. Full Product DetailsAuthor: W.K. Jones , Karel Kurzweil , Gábor Harsányi , Sylvia MerguiPublisher: Springer Imprint: Springer Edition: 1995 ed. Volume: 2 Dimensions: Width: 15.50cm , Height: 1.90cm , Length: 23.50cm Weight: 1.420kg ISBN: 9780792334606ISBN 10: 0792334604 Pages: 318 Publication Date: 30 April 1995 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print  This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of Contents“3-D Interconnection Microsystems Applications,”.- “High Performance Packaging with Multilayer Ceramic Modules,”.- “High Frequency LTCC Modules,”.- “Analysis and Optimization of Circuit Interconnect Performance,”.- “High Performance Interconnect on Cofired Ceramic,”.- “New Aspects in the Reliability Design of High Density Interconnects in MCMs,”.- “MCM-D Technology with Active and Passive Substrates,”.- “High Performance Ceramic Modules and Packages,”.- “Laser Processing in MCM-C Technologies,”.- “LTCC Technology: Where We Are and Where We’re Going,”.- “Design and Realization of High Performance Ceramic Heat Sinks,”.- “AlN Cofired MCM-C/D,”.- “Very Fine Line Photoimageable Thick Film Technology Developed at Hybridas, Lithuania,“.- “High-Performance Solid State Mass Memory Modules,”.- “Mass Memory Packaging for Space Applications,”.- “Advanced Multichip Modules for Telecom Applications,”.- “Telecom Applications of MCM Technology,”.- “Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications,”.- “Multichip Module Applications in Satellite Communications,”.- “Materials/Design Considerations for MCMs,”.- “MCMs: Material Choices for Electronics and Optoelectronics,”.- “Low Permittivity Porous Silica Thin Films for MCM-C/D Applications,”.- “MCM Passivation Studies for Enhanced Producibility and Reliability,”.- “Buried Thick Film Capacitors Built Up with High-K Dielectrics for MCM Applications,”.- “Advances in Materials for Sensors,”.- “PTC Thick Film Thermistors,”.- “Evaluation of Some Thick Film Materials for Temperature, Force, and Humidity Sensors,”.- “Parameters and Technology of Thick Film Electrolytic SO2 Sensors,”.-“Sensors: A Great Chance for Microelectronic Technologies,”.- “High Sensitivity Thermometers for Millikelvin Temperature Range,”.- “Thick Films Based on Glass and Polymeric Matrices, Mechanism of Conductivity,”.- Author Index.- Keyword Index.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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