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OverviewMajor benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities. Full Product DetailsAuthor: National Research Council , National Research Committee on Materials for High-Temperature Semiconductor Devices Commission on Engineering and Technical Systems , Committee on Materials for High-Temperature Semiconductor Devices Commission on EngineeriPublisher: National Academies Press Imprint: National Academies Press ISBN: 9781280192760ISBN 10: 1280192763 Pages: 119 Publication Date: 01 January 1995 Audience: General/trade , General Format: Electronic book text Publisher's Status: Active Availability: In stock  We have confirmation that this item is in stock with the supplier. It will be ordered in for you and dispatched immediately. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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