Overview

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Full Product Details

Author:   Daniel Lu ,  C. P. Wong
Publisher:   Springer-Verlag New York Inc.
Imprint:   Springer-Verlag New York Inc.
Edition:   1st ed. Softcover of orig. ed. 2009
Dimensions:   Width: 15.60cm , Height: 3.70cm , Length: 23.40cm
Weight:   1.104kg
ISBN:  

9781441946119

ISBN 10:   144194611
Pages:   724
Publication Date:   04 November 2010
Audience:   Professional and scholarly ,  Professional & Vocational
Replaced By:   9783319450971
Format:   Paperback
Publisher's Status:   Out of Print
Availability:   In Print  
Limited stock is available. It will be ordered for you and shipped pending supplier's limited stock.

Table of Contents

3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.

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