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OverviewFull Product DetailsAuthor: J.M. Martinez-Duart (Fisica Aplicada, Universidad Cantoblanco, Madrid, Spain) , R. Madar (LMPG-ENSPG, Saint Martin d'Hères, France) , R.A. Levy (New Jersey Institute of Technology, Newark, NJ, USA)Publisher: Elsevier Science & Technology Imprint: Elsevier Science Ltd Volume: v. 89 Weight: 0.570kg ISBN: 9780080436173ISBN 10: 008043617 Pages: 180 Publication Date: 03 November 1999 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Out of stock  The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available. Table of ContentsSelected papers: Interconnect technology trend for microelectronics (R.Liu et al.). Study of C contamination during copper integration for subquarter micron technology (P. Motte et al.). Cobalt silicide thermal stability: from blanket thin film to submicrometer lines (A. Alberti et al.). TEM studies of the microstructure evolution in plasma treated CVD TiN thin films used as diffusion barriers (S. Ikeda et al.). Sputtered tungsten films on polyimide, an application for X-ray masks (J. Ligot et al.). Nanometer scale lithography on silicon, titanium and PMMA resist using scanning probe microscopy (E. Dubois, J.-L. Bubbendorff). Oxidation of rf plasma: hydrogenated crystalline Si (S. Alexandrova et al.). Determination of the spectral behaviour of porous silicon based photodiodes (R.J. Martín-Palma et al.).ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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