|
|
|||
|
||||
OverviewLead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests. Full Product DetailsAuthor: John Hock Lye PangPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: 2012 Dimensions: Width: 15.50cm , Height: 1.20cm , Length: 23.50cm Weight: 0.454kg ISBN: 9781461404620ISBN 10: 1461404622 Pages: 175 Publication Date: 14 October 2011 Audience: Professional and scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: Awaiting stock The supplier is currently out of stock of this item. It will be ordered for you and placed on backorder. Once it does come back in stock, we will ship it out for you. Table of ContentsIntroduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test ResultReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |