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OverviewThis monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly. Full Product DetailsAuthor: A C Tan (.) , A C Tan (.)Publisher: EPB Publishers Pte Ltd Imprint: EPB Publishers Pte Ltd ISBN: 9789971506797ISBN 10: 9971506793 Pages: 268 Publication Date: 01 April 1989 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: To order  Stock availability from the supplier is unknown. We will order it for you and ship this item to you once it is received by us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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