Overview

The conference is focused on recent advances and emerging technologies in semiconductor processing before, during and after ion implantation. The content encompasses fundamental physical understanding, common and novel applications as well as equipment issues, maintenance and design. The primary audience is process engineers in the microelectronics industry. Additional contributions come from academia and other industry segments (automotive, aerospace, and medical device manufacturing).

Full Product Details

Author:   Edmund G. Seebauer ,  Susan B. Felch ,  Amitabh Jain ,  Yevgeniy V. Kondratenko
Publisher:   American Institute of Physics
Imprint:   American Institute of Physics
Edition:   2008 ed.
Volume:   No. 1066
Dimensions:   Width: 21.60cm , Height: 3.60cm , Length: 27.90cm
Weight:   1.538kg
ISBN:  

9780735405974

ISBN 10:   0735405972
Pages:   576
Publication Date:   01 December 2008
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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