Overview

The conference is focused on recent advances and emerging technologies in semiconductor processing before, during and after ion implantation. The content encompasses fundamental physical understanding, common and novel applications as well as equipment issues, maintenance and design. The primary audience is process engineers in the microelectronics industry. Additional contributions come from academia and other industry segments (automotive, aerospace, and medical device manufacturing).

Full Product Details

Author:   Edmund G. Seebauer ,  Susan B. Felch ,  Amitabh Jain ,  Yevgeniy V. Kondratenko
Publisher:   American Institute of Physics
Imprint:   American Institute of Physics
Volume:   No. 1066
Dimensions:   Width: 21.60cm , Height: 1.00cm , Length: 27.90cm
Weight:   0.068kg
ISBN:  

9780735406346

ISBN 10:   0735406340
Pages:   576
Publication Date:   17 March 2009
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   CD-ROM
Publisher's Status:   Active
Availability:   In Print  
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