Integrated Passive Component Technology

Author:   Richard K. Ulrich (University of Arkansas at Fayetteville, AR) ,  Leonard W. Schaper (University of Arkansas at Fayetteville, AR)
Publisher:   John Wiley & Sons Inc
ISBN:  

9780471244318


Pages:   379
Publication Date:   11 July 2003
Format:   Hardback
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Integrated Passive Component Technology


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Full Product Details

Author:   Richard K. Ulrich (University of Arkansas at Fayetteville, AR) ,  Leonard W. Schaper (University of Arkansas at Fayetteville, AR)
Publisher:   John Wiley & Sons Inc
Imprint:   Wiley-IEEE Press
Dimensions:   Width: 16.20cm , Height: 2.40cm , Length: 24.50cm
Weight:   0.683kg
ISBN:  

9780471244318


ISBN 10:   0471244317
Pages:   379
Publication Date:   11 July 2003
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   Out of stock   Availability explained
The supplier is temporarily out of stock of this item. It will be ordered for you on backorder and shipped when it becomes available.

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Reviews

a comprehensive look at the reasons and current challenges [of integrating] passive devices into board or IC just the right dose of the math to explain the physics and theory behind the technology. ( IEEE Circuits & Devices Magazine, Jan/Feb 2005) ...an interesting and useful book; I wholeheartedly recommend it. (Circuit World, Vol.30, No. 2003)


...a comprehensive look at the reasons and current challenges...[of integrating] passive devices into board or IC...just the right dose of the math to explain the physics and theory behind the technology. (IEEE Circuits & Devices Magazine, Jan/Feb 2005) ...an interesting and useful book; I wholeheartedly recommend it. (Circuit World, Vol.30, No. 2003)


Author Information

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division. LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

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