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OverviewThis book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an ""integrated model"". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The ""integrated model"" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. Full Product DetailsAuthor: Jianfeng Luo , David A. DornfeldPublisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K Edition: 2004 ed. Dimensions: Width: 15.50cm , Height: 2.00cm , Length: 23.50cm Weight: 1.440kg ISBN: 9783540223696ISBN 10: 354022369 Pages: 311 Publication Date: 07 October 2004 Audience: College/higher education , Professional and scholarly , Postgraduate, Research & Scholarly , Professional & Vocational Format: Hardback Publisher's Status: Active Availability: In Print This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us. Table of ContentsReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
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