Overview

Full Product Details

Author:   Eugene R. Hnatek (Encinitas, California, USA)
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Edition:   2nd edition
Volume:   v. 91
Dimensions:   Width: 15.20cm , Height: 4.20cm , Length: 22.90cm
Weight:   1.650kg
ISBN:  

9780824792831

ISBN 10:   0824792831
Pages:   808
Publication Date:   01 December 1994
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Reviews

The new edition brings the baseline IC technology and tool set up to date. . ..it covers all the material in more depth than the first edition. . .. . . .a good tutorial on IC fabrication and packaging, including quality concerns. . .. Excellent chapters on design, fabrication, packaging, and test put today's engineer in a good position to understand the impact of contamination and manufacturing errors on their IC products. ---IEEE Components, Packaging, and Manufacturing Technology Society Newsletter

Author Information

Hnatek, Eugene R.

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