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Full Product Details

Author:   Pradeep Lall ,  Michael G. Pecht ,  Edward B. Hakim
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Dimensions:   Width: 17.80cm , Height: 2.10cm , Length: 25.40cm
Weight:   0.975kg
ISBN:  

9780849394508

ISBN 10:   0849394503
Pages:   328
Publication Date:   24 April 1997
Audience:   College/higher education ,  Professional and scholarly ,  Postgraduate, Research & Scholarly ,  Professional & Vocational
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print  
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Table of Contents

Does the Cooling of Electronics Increase Reliability? Temperature Dependence of Microelectronic Package Failure Mechanisms Temperature Dependencies of Failure Mechanisms in the Die Metallization Effect of Hydrogen (H2) and Helium (He) Ambients On Metallization Versus Temperature Temperature Dependencies of Failure Mechanisms in the Device Oxide Temperature Dependencies of Failure Mechanisms in the Device Temperature Dependencies of Failure Mechanisms in the Device Oxide Interface Temperature Dependence of Microelectronic Package Failure Mechanisms Temperature Dependencies of Failure Mechanisms in the Die and Die/Substrate Attach Temperature Dependencies of Failure Mechanisms in First-Level Interconnections Temperature Dependencies of Failure Mechanisms in the Package Case Electrical Parameter Variations in Bipolar Devices Introduction Temperature Dependence of Bipolar Junction Transistor Parameters Electrical Parameter Variations in Mosfet Devices Temperature Dependence of Mosfet Parameters A Physics-of-Failure Approach to IC Burn-In Introduction Burn-In Philosophy Problems with Present Approach to Burn-In A Physics-of-Failure Approach to Burn-In Derating Guidelines for Temperature-Tolerant Design of Microelectronic Devices Introduction Problems with the Present Approach to Device Derating A Physics-of-Failure Approach to Device Derating Derating for Failure Mechanisms in Die Metallization Derating Guidelines for Temperature-Tolerant Design of Electronic Packages Derating for Failure Mechanisms in the Die and Die/Substrate Attach Derating for Failure Mechanisms in the First-Level Interconnects Derating for Failure Mechanisms in the Package Case A Guide for Steady State Temperature Effects

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Author Information

Lall, Pradeep; Pecht, Michael; Hakim, Edward B.

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