Free Delivery Over $100
|
|
|||
|
||||
OverviewPower supply current monitoring to detect CMOS IC defects during production testing quietly laid down its roots in the mid-1970s. Both Sandia Labs and RCA in the United States and Philips Labs in the Netherlands practiced this procedure on their CMOS ICs. At that time, this practice stemmed simply from an intuitive sense that CMOS ICs showing abnormal quiescent power supply current (IDDQ) contained defects. Later, this intuition was supported by data and analysis in the 1980s by Levi (RACD, Malaiya and Su (SUNY-Binghamton), Soden and Hawkins (Sandia Labs and the University of New Mexico), Jacomino and co-workers (Laboratoire d'Automatique de Grenoble), and Maly and co-workers (Carnegie Mellon University). Interest in IDDQ testing has advanced beyond the data reported in the 1980s and is now focused on applications and evaluations involving larger volumes of ICs that improve quality beyond what can be achieved by previous conventional means. In the conventional style of testing one attempts to propagate the logic states of the suspended nodes to primary outputs. This is done for all or most nodes of the circuit. For sequential circuits, in particular, the complexity of finding suitable tests is very high. In comparison, the IDDQ test does not observe the logic states, but measures the integrated current that leaks through all gates. In other words, it is like measuring a patient's temperature to determine the state of health. Despite perceived advantages, during the years that followed its initial announcements, skepticism about the practicality of IDDQ testing prevailed. The idea, however, provided a great opportunity to researchers. New results on test generation, fault simulation, design for testability, built-in self-test, and diagnosis for this style of testing have since been reported. After a decade of research, we are definitely closer to practice. Full Product DetailsAuthor: Ravi K. Gulati , Charles F. HawkinsPublisher: Springer-Verlag New York Inc. Imprint: Springer-Verlag New York Inc. Edition: Softcover reprint of the original 1st ed. 1993 Dimensions: Width: 17.80cm , Height: 0.70cm , Length: 25.40cm Weight: 0.264kg ISBN: 9781461363774ISBN 10: 1461363772 Pages: 124 Publication Date: 12 October 2012 Audience: Professional and scholarly , Professional & Vocational Format: Paperback Publisher's Status: Active Availability: Manufactured on demand  We will order this item for you from a manufactured on demand supplier. Table of ContentsIDDQ Testing: A Review.- Iddq Testing as a Component of a Test Suite: The Need for Several Fault Coverage Metrics.- Iddq Testing in CMOS Digital ASICs.- Reliability Benefits of IDDQ.- Quiescent Current Analysis and Experimentation of Defective CMOS Circuits.- QUIETEST: A Methodology for Selecting IDDQ Test Vectors.- Generation and Evaluation of Current and Logic Tests for Switch-Level Sequential Circuits.- Diagnosis of Leakage Faults with IDDQ.- Algorithms for IDDQ Measurement Based Diagnosis of Bridging Faults.- Proportional BIC Sensor for Current Testing.- Design of ICs Applying Built-in Current Testing.ReviewsAuthor InformationTab Content 6Author Website:Countries AvailableAll regions |
||||
