How Transistor Area Shrank by 1 Million Fold

Author:   Howard Tigelaar
Publisher:   Springer Nature Switzerland AG
Edition:   1st ed. 2020
ISBN:  

9783030400231


Pages:   319
Publication Date:   16 July 2021
Format:   Paperback
Availability:   Manufactured on demand   Availability explained
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How Transistor Area Shrank by 1 Million Fold


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​This book explains in layman’s terms how CMOS transistors work.  The author explains step-by-step how CMOS transistors are built, along with an explanation of the purpose of each process step. He describes for readers the key inventions and developments in science and engineering that overcame huge obstacles, enabling engineers to shrink transistor area by over 1 million fold and build billions of transistor switches that switch over a billion times a second, all on a piece of silicon smaller than a thumbnail.

Full Product Details

Author:   Howard Tigelaar
Publisher:   Springer Nature Switzerland AG
Imprint:   Springer Nature Switzerland AG
Edition:   1st ed. 2020
Weight:   0.528kg
ISBN:  

9783030400231


ISBN 10:   3030400239
Pages:   319
Publication Date:   16 July 2021
Audience:   Professional and scholarly ,  Professional & Vocational
Format:   Paperback
Publisher's Status:   Active
Availability:   Manufactured on demand   Availability explained
We will order this item for you from a manufactured on demand supplier.

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Education:   Ph.D. Physical Chemistry, U. of Illinois.   Postdoctorate in Physics and Quantum Optics, U. of Arizona.  Postgraduate courses in Solid State Physics at U. of Texas Dallas and U. of Texas Arlington.  8 years – Tigelaar Consulting, LLC.  Wrote 150+ patent applications for Customer.  Yield consultant to several major semiconductor companies.  Technical advisor to 3 startup companies. 2 years – PDF Solutions:  Senior consultant.  Yield enhancement and SRAM layout. 26 years - Texas Instruments, Inc.   Managed technical engineering groups.  Developed manufacturing flows for next generation integrated circuits.  70+ US patents.  40+ publications in technical journals.  TI Fellow. 4 years - Abbott Labs, Inc.  Managed Technical Troubleshooting group that diagnosed and fixed production problems and customer problems with Abbott’s diagnostic kits. 5 years - Rohm and Haas Co.   Plastics Engineer, Developed production procedures for diagnostic reagents.  Setup and managed the production facility for RIA diagnostic kits for Micromedic Systems, Inc., a subsidiary of Rohm and Hass Co.    1 patent.  Cofounder of Testchip Technologies, LLC.   Developed automated software for testchip layout.

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