Overview

The Handbook of Thin Film Process Technology, CD-ROM reproduces the text version in its entirety, including illustrations and references from the print edition. With full printing functionality, the CD has all of the added benefits associated with CD-ROM technology, such as easy searching and browsing and hypertext linking and bookmarking,. As a bonus, the CD-ROM also contains both 1996 supplements. Some of the other features include: Compatibility with Macintosh and Windows platforms Simple and Boolean searching Intuitive push button data navigation through the Acrobat interface True page image replication on the computer screen Page zoom enlargement and reduction Word Stemming and Word Proximity searching Thesaurus searching Searchable on-line users guide

Full Product Details

Author:   D Glocker (Isoflux Inc, USA) ,  S Shah (University of Delaware, USA)
Publisher:   Taylor & Francis Ltd
Imprint:   Institute of Physics Publishing
Dimensions:   Width: 12.70cm , Height: 1.00cm , Length: 17.80cm
Weight:   0.045kg
ISBN:  

9780750304092

ISBN 10:   075030409
Publication Date:   01 January 1997
Audience:   Professional and scholarly ,  Professional and scholarly ,  Professional & Vocational ,  Professional & Vocational
Format:   CD-ROM
Publisher's Status:   Unknown
Availability:   Out of stock  

Table of Contents

PHYSICAL DEPOSITION TECHNIQUES Thermal Evaporation (Coordinating Editors: E.B. Graper and J. Vossen) Introduction and general discussion (E.B. Graper) Resistance evaporation (E.B. Graper) Electron beam evaporation (E.B. Graper) Ion vapor evaporation (E.B. Graper) Cathodic arc deposition (P.J. Martin) Laser ablation (A. Morimoto and T. Shimizu) Molecular Beam Epitaxy (Coordinating Editors: S.A. Barnett and J. Poate) Introduction and general discussion (S.A. Barnett and I.T. Ferguson) Semiconductor growth by metalorganic molecular beam epitaxy (MOMBE) (C.R. Abernathy) Gas-source MBE (G.Y. Robinson) Chemical beam epitaxy (T.H. Chiu) Thin film deposition and dopant incorporation by energetic particle sources (S. Strite and H. Morkoc) Sputtering (Coordinating Editors: S.I. Shah and D. Glocker) Introduction and general discussion (S.I. Shah) Glow discharge sputtering (A.S. Penfold) Magneton sputtering (A.S. Penfold) Ion-beam sputtering (T. Itoh) Thermal Spraying (Coordinating Editor: R.C. Tucker Jr.) Introduction to thermal spray coatings (R.C. Tucker Jr.) Flame spray (P.A. Kammer) Plasma spray coatings (R.C. Tucker Jr.) High velocity oxy-fuel coatings (R.C. Tucker Jr.) Detonation gun deposition (R.C. Tucker Jr.) Mechanical, wear, corrosion, and other properties of thermal spray coatings (R.C. Tucker Jr.) CHEMICAL DEPOSITION TECHNIQUES Chemical Vapor Deposition (Coordinating Editor: L. Vescan) Introduction and general discussion (L. Vescan) Metalorganic chemical vapour deposition (MOCVD) (R.D. Dupuis) Photoassisted chemical vapour deposition (S.J.C. Irvine) Thermally activated chemical vapour deposition (L. Vescan) Atomic layer epitaxy (T. Suntola) PROCESSING TECHNOLOGIES Pattern Transfer (Coordinating Editor: J.W. Coburn Introduction and general discussion (J.W. Coburn) Reactive ion etching (C. Steinbruchel) Ion-beam-based chemical dry etching (C. Steinbruchel) Ion milling (C. Steinbruchel) REAL-TIME DIAGNOSTICS Introduction and General Discussion (Coordinating Editor: R.W. Collins) Diagnostic Techniques Reflection high-energy electron diffraction as a diagnostic technique (B.A. Joyce) Low-energy electron diffraction (Sheng-Liang Chang and P.A. Thiel) Reflection mass spectroscopy (R. Kaspi) Optical Diagnostics Infrared emission interferometry (A.J. Springthorpe) Reflectance anisotropy (B. Drevillon) Interferometry as an in situ probe during processing of semiconductor wafers (V.M. Donnelly) Ellipsometry (P. Snyder) Photoluminescence (P.R. Berger) Elastic laser light scattering (B. Gallois) Plasma Probes Langmuir probe diagnostics (N. Hershkowitz) Microwave interferometers (R.A. Breun) Atomic absorption spectroscopy (Chih-shun Lu) Other Diagnostics (Coordinating Editor: R. Collins) Quartz monitors and microbalances (J. Krim and C. Daly) Probes of film stress (D. Glocker) SURFACE MODIFICATION IN VACUUM Processes for Substrate Cleaning (D. Mattox) Surface Treatment for Corrosion and Wear Protection Material aspects of corrosion protection (Cathy Cotell) Ion implantation with beams (Mike Nastasi) Plasma source ion implantation (Donald Rej) Surface Treatment of Polymers for Adhesion Plasma sources for polymer surface treatment (M.R. Wertheimer and Edward Liston) Surface chemistry of treated polymers (Lou Gerenser) MATERIALS Hard and Protective Materials Introduction (O. Knotek and A. Schrey) TiN TiAIN TiAIVN CrN ZrN HfN BN Diamond Ni-Cr-B-Si Al-bronze Al2O3-TiO2 Electronic Materials Introduction (K. Cadien and S. Sivaram) GaAs a-Si:H AlGaAs Tellurides CuInSe2 Si Ge Si-Ge W GaN AIN ErAs Quaternaries Silicides SiSnC SiN Optical Materials Introduction (J. Targove) AIN ZnO PbTiO3 KNbO3 Ferroelectric Materials Introduction (M. Sayer) Bi4Ti3O12 LiNbO3 and LiTaO3 PbTiO3/PbZrTiO3 Ferromagnetic Materials Introduction (E.M.T. Velu and D.N. Lambeth) CoCr TbFeCo CoPt/CoPd GdTbFe Superconducting Materials Introduction (J. Azoulay) NbN YBa2Cu3O7 Thallium-based compounds Mercury-based compounds Miscellaneous Materials PTFE PPN Ir/Pt Appendix A: List of Contributors Subject Index

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