Handbook of Electronic Package Design

Author:   Michael Pecht (University of Maryland, College Park, USA) ,  Lynn Faulkner (Battelle, Columbus, Ohio, USA)
Publisher:   Taylor & Francis Inc
Volume:   76
ISBN:  

9780824779214


Pages:   892
Publication Date:   16 August 1991
Format:   Hardback
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

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Handbook of Electronic Package Design


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Full Product Details

Author:   Michael Pecht (University of Maryland, College Park, USA) ,  Lynn Faulkner (Battelle, Columbus, Ohio, USA)
Publisher:   Taylor & Francis Inc
Imprint:   CRC Press Inc
Volume:   76
Dimensions:   Width: 17.40cm , Height: 4.50cm , Length: 24.60cm
Weight:   1.678kg
ISBN:  

9780824779214


ISBN 10:   0824779215
Pages:   892
Publication Date:   16 August 1991
Audience:   College/higher education ,  Professional and scholarly ,  Undergraduate ,  Postgraduate, Research & Scholarly
Format:   Hardback
Publisher's Status:   Active
Availability:   In Print   Availability explained
This item will be ordered in for you from one of our suppliers. Upon receipt, we will promptly dispatch it out to you. For in store availability, please contact us.

Table of Contents

"""Introduction, Michael D. Osterman and Michael Pecht Electronic Components, Denise BurkusHarris, Michael Pecht, and Pradeep Lall Printed Wiring Board Design and Fabrication, Denise Burkus Harris and Pradeep Lall Electronic Assemblies, Denise Burkus Harris Interconnections and Connectors, Pradeep Lall and Michael Pecht Layout, Michael D. Osterman and Michael Pecht Thermal Design Analysis, Dennis K. Karr, David Dancer, and Milton Palmes, III Thermomechanical Analysis and Design, Abhijit Dasgupta Vibration and Shock Analysis and Design, Donald B. Barker Humidity and Corrosion Analysis and Design, Wing C. Ko and Michael Pecht Design for Reliability, Michael Pecht Electronic Materials and Properties, Jillian Y. Evans and John W. Evans Appendix A: Acronyms Used in Electronics Appendix B: Glossary of Hybrid Microcircuits Packaging Terms Appendix C: Standards and Specifications for Microelectronics Appendix D: Standards and Specifications for PCBs and PWBs Appendix E: Unit Conversion Tables """

Reviews

Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. ---IEEE Book Review


"""Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. "" ---IEEE Book Review"


Prepared in a manner suitable for teaching and including end-of-chapter problems, this book well meets the needs for a teaching text. . ..Several useful appendices are also included. ---IEEE Book Review


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Michael Pecht

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